High Coplanarity and Fine Pitch Copper Pillar Bumps Fabrication Method

Huang, Jung-Tang; Hsu, Hou-Jun; Lee, Kuo-Yu; Tsai, Ting-Chiang; Chen, Ching-Kong

doi:10.1143/jjap.49.06gn07

Cited by 2 publications

(3 citation statements)

References 7 publications

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“…The prepared bumps have a regular morphology, and there are no impurities and voids inside the bumps, which confirms that it is a feasible and practical approach [6]. Unfortunately, previous studies have not investigated the uniformity of bump arrays, and the existing studies on bump consistency have concentrated on large-feature-sizes and low-density bump arrays [3,4,7], leaving much space for exploration of small-dimension bump arrays with pith inside 10 μm. Besides, there are several urgent concerns during the fabrication process, such as skip plating, hydrogen bubble entrapment, and nodular growth, which will be discussed in detail in the subsequent chapter.…”

Section: Introductionmentioning

confidence: 58%

“…IOP Publishing doi:10.1088/1742-6596/2783/1/012022 2 High-uniformity bump arrays are essential for bonding yields and display device quality, and current procedures for preparing Micro-LED bumps include electroplating [3], evaporation [4], and electroless plating [5]. Electroplating is an electrochemical process that requires the introduction of current during the preparation process.…”

Section: Introductionmentioning

confidence: 99%

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Electroless deposition of nickel microbumps for fine-pith flip-chip bonding

Lu,

Lin,

Wang

et al. 2024

J. Phys.: Conf. Ser.

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The reliability of micro-light-emitting diode (Micro-LED) is closely associated with the uniformity of microbumps arrays. With continual decreases in pixel pitch in recent years, it is a challenge to guarantee the uniformity of bump arrays. To satisfy current requirements for ultra-high-density interconnections, this study proposes an electroless plating method for fabricating highly uniform nickel microbumps. This technique differs from electroplating, in which the morphology and consistency of microbumps can be easily controlled. Furthermore, it is a high-selectivity and cost-effective method of microbumps fabrication that eliminates solder wastage and avoids metal lift-off in traditional evaporation. To minimize the non-uniformity of the bumps, we aim to optimize the oxygen plasma treatment parameters and deposition intervals to eliminate the issues of skip plating, hydrogen bubble entrapment, and nodules. Under the combined effect of plasma treatment and intermittent deposition method, microbump arrays with less than 5% uniformity were successfully prepared, achieving the demands of high-density bonding. In addition, the preparation process is highly reproducible, extending the application range of this technique.

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Section: Introductionmentioning

confidence: 58%

Section: Introductionmentioning

confidence: 99%

Electroless deposition of nickel microbumps for fine-pith flip-chip bonding

Lu,

Lin,

Wang

et al. 2024

J. Phys.: Conf. Ser.

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“…Recently, copper pillar bump technology is receiving great attention for flip chip package as well as other advanced packaging methods due to their many advantageous features such as lower joint resistance, better electromigration resistance, higher I/O density, finer pitch, and better thermal dissipation than solder bumps. [1][2][3] Copper pillar bump is composed of copper pillar and solder cap. Copper pillar connects solder with under bump metallurgy (UBM) and chip pad.…”

mentioning

confidence: 99%

Method to Improve the Process Efficiency for Copper Pillar Electroplating

Luo

Xue

et al. 2015

J. Electrochem. Soc.

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With the progress of wafer level and chip scale packaging, copper pillar bump technology has been applied in advanced assembly due to the advantage of fine pitch capability, better electrical performance and lower power consumption. As one of the critical process of copper pillar bump technology, electroplating process is gaining more and more interests from the semiconductor packaging R&D community. In this work, two different electroplating processes, i.e. single-rate plating method and multi-rate plating method, have been studied. The impacts on bump height co-planarity, copper pillar profile and wafer stress are further evaluated. By applying multi-rate plating method, better copper pillar bump performance and higher electroplating efficiency can be both achieved.

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High Coplanarity and Fine Pitch Copper Pillar Bumps Fabrication Method

Cited by 2 publications

References 7 publications

Electroless deposition of nickel microbumps for fine-pith flip-chip bonding

Electroless deposition of nickel microbumps for fine-pith flip-chip bonding

Method to Improve the Process Efficiency for Copper Pillar Electroplating

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