High Bandwidth Memory Interface on Organic Substrate: Challenges to Electrical Design

Heyfitch, Vadim; Dong, Shao-Jing; Na, Nanju; Shi, Hong; Gandhi, Jarel K.; Xi, Jane; Wu, Shaoen

doi:10.1109/ectc.2018.00198

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) 2018

DOI: 10.1109/ectc.2018.00198

|View full text |Cite

High Bandwidth Memory Interface on Organic Substrate: Challenges to Electrical Design

Vadim Heyfitch

Shao-Jing Dong

Nanju Na

et al.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2019

2022

Publication Types

Select...

Other5

Relationship

Self Cite0

Independent5

Authors

Journals

Cited by 10 publications

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

Submicron-Scale Cu RDL Pattering Based on Semi-Additive Process for Heterogeneous Integration

Takano¹,

Kawamura²,

Tanaka³

et al. 2019

2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

View full text Add to dashboard Cite

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

High Bandwidth Memory Interface on Organic Substrate: Challenges to Electrical Design

Cited by 10 publications

References 1 publication

Submicron-Scale Cu RDL Pattering Based on Semi-Additive Process for Heterogeneous Integration

Submicron-Scale Cu RDL Pattering Based on Semi-Additive Process for Heterogeneous Integration

Signal Integrity of Submicron InFO Heterogeneous Integration for High Performance Computing Applications

Electrical design challenges in High Bandwidth Memory and Advanced Interface Bus interfaces on HD-FOWLP technology

Contact Info

Product

Resources

About