High-aspect-ratio metal microchannel plates for microelectronic cooling applications

Yu, Weixing; Desmulliez, Marc Phillipe Yves; Drufke, A; Leonard, Mark; Dhariwal, R. S.; Flynn, David; Bognár, G.; Poppe, A.; Horváth, Gergely; Kohari, Z.; Rencz, M.

doi:10.1088/0960-1317/20/2/025004

Cited by 35 publications

(19 citation statements)

References 15 publications

(25 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The Ni metals have been widely used in the field of aerospace and automotive industries as well as non-silicon MEMS technology [5]. The weak adhesion strength between Ni/Ni layers often leads to the delamination and failure in the harsh working environment, such as the removing of photoresist [6][7][8]. Therefore, it is a necessary and urgent task to improve the adhesion strength of the Ni/Ni films in MEMS to obtain high quality devices for reliability and long lifespans.…”

Section: Introductionmentioning

confidence: 99%

Adhesion Performance of Electrodeposited Ni Films with Different Treating Methods

et al. 2018

View full text Add to dashboard Cite

Abstract:The adhesion strength between thin films has a significant effect on performance of micro-devices. It is introduced that the effects of three pre-treatment methods: acid, pulse reverse current and anodic current, on the adhesion performance of electrodeposited Ni films on Ni substrate. The adhesion strength, surface and fracture morphology of the Ni films were investigated. The dense oxide films on the Ni substrate were removed effectively by using the anodic dissolution current method in the acidic chloride solutions. Meanwhile, the Ni films treated with specific treatment conditions produced different roughness, which was responsible for the improved adhesion strength. The adhesion strength of the Ni films increased up to 629.8 MPa when substrates were treated with anodic current density of 30 mA/cm 2 for 10 min, which is nearly two times higher than that of films treated by 5 vol % HCl for 10 min. The results indicate that the anodic current treatment method effectively improves the adhesion strength of Ni films.

show abstract

Section: Introductionmentioning

confidence: 99%

Adhesion Performance of Electrodeposited Ni Films with Different Treating Methods

et al. 2018

View full text Add to dashboard Cite

show abstract

“…It obeys the rule of the minimum energy loss in order to absorb more nutrition for photosynthesis, which has been widely applied in many areas including micro-electronics, space flight, and medicine and so on in last century. [10][11][12][13][14][15][16][17] For the microfluidic planar reactors, the minimum energy loss is also important. This is to minimize the effective power that is used to pump the fluids through the reactors.…”

Section: Introductionmentioning

confidence: 99%

Biomimetic microchannels of planar reactors for optimized photocatalytic efficiency of water purification

Liao

Wang

et al. 2016

Biomicrofluidics

View full text Add to dashboard Cite

This paper reports a biomimetic design of microchannels in the planar reactors with the aim to optimize the photocatalytic efficiency of water purification. Inspired from biology, a bifurcated microchannel has been designed based on the Murray's law to connect to the reaction chamber for photocatalytic reaction. The microchannels are designed to have a constant depth of 50 lm but variable aspect ratios ranging from 0.015 to 0.125. To prove its effectiveness for photocatalytic water purification, the biomimetic planar reactors have been tested and compared with the non-biomimetic ones, showing an improvement of the degradation efficiency by 68%. By employing the finite element method, the flow process of the designed microchannel reactors has been simulated and analyzed. It is found that the biomimetic design owns a larger flow velocity fluctuation than that of the nonbiomimetic one, which in turn results in a faster photocatalytic reaction speed. Such a biomimetic design paves the way for the design of more efficient planar reactors and may also find applications in other microfluidic systems that involve the use of microchannels. V C 2016 AIP Publishing LLC.

show abstract

“…: PN junction or channels of field-effect transistors) is conducted through the cooling solutions can be included into the overall design flow of the entire system. Generally parallel channels or channels in radial arrangement are formed as it was presented in Yu et al (2010). However, the geometry (width, depth, formation, etc.)…”

Section: Introductionmentioning

confidence: 99%

“…Several previous papers, Prechtl and Kurtz (2004), Yu et al (2010), Kohári et al (2007) and Bognár (2005) presented the basic idea which could be successfully applied to determine the flow dependent thermal properties of the microscale cooler structures, but the validity and repeatability of these methods were problematic. In Tummala (2007) the authors mentioned that it was not possible to determine the contribution from the individual components of the total unit thermal resistance.…”

Section: Introductionmentioning

confidence: 99%

Modelling of the flow-rate dependent partial thermal resistance of integrated microscale cooling structures

2016

View full text Add to dashboard Cite

path(s) with the smallest thermal resistance. In the case of packaged semiconductor devices, the dissipated energy is mainly conducted through the semiconductor die towards the backside of the die, then through several TIM (thermal interface material) layers to the passive or active cooling device (e.g.: heat sinks, heat-pipes, etc.). In order to ensure the lowest thermal resistance path the number of thermal interfaces (material transitions, mating assembly surfaces) has to be minimized. In System-in-Package (SiP) or System-on-Package (SoP) (Tummala 2007) structures the different dies are stacked on each other forming a real 3D structure. Between the dies high resistivity layers (made of some kind of glass) are formed to ensure electrical insulation. These layers also have high thermal resistivity (not to mention the thermal interfaces formed at the sides of these interposer layers), therefore the temperature elevation is higher as if the whole 3D structure was made of silicon.One way to decrease the overall thermal resistance of such a system is to bring the cooling structures closer to the dissipation sources (from now on simply referred to as junction). The thermally optimal solution is to integrate the cooling solutions into the 3D stack. Such integrated cooling solutions include integrated micro-refrigerators structures attached close to the hot-spot locations. In these applications high heat-fluxes (up to a few 100 W/cm 2 ) can be achieved with localized cooling (Jeffrey 2006). Papers Tang et al. (2010); Sabry (2011) present the method and the results of forming a microscale channel structure with circulating fluid inside. Other papers, Prechtl and Kurtz (2004) and Vladimirova (2011) describe microscale channel structure inside the die itself.Though these papers present promising new integrated cooling techniques but they do not mention how the physical realization is optimized to achieve the best possible heat transfer and they do not address how the design of these Abstract As microscale cooling structures are integral parts of modern chip level cooling concepts, the understanding the behaviour of different assemblies is desirable. This way novel co-design concepts can be created where the conventional IC design steps are extended with thermal design capabilities resulting in a SiP/SoP design flow. The first step in this process is to create a general formula which describes the heat transfer mechanism and can be implemented in IC CAD environments as a compact model. This paper presents an analytical study of an integrated microscale channel based cooling structure with the above motivation in mind. A closed analytical formula is given to calculate the partial thermal resistance corresponding to the heat transfer represented by the coolant which can be used in electro-thermal co-simulation. The analyses based on numerical CFD simulations and thermal transient characterizations of a realized structure are also discussed and the results are compared against the analytical ones.

show abstract

High-aspect-ratio metal microchannel plates for microelectronic cooling applications

Cited by 35 publications

References 15 publications

Adhesion Performance of Electrodeposited Ni Films with Different Treating Methods

Adhesion Performance of Electrodeposited Ni Films with Different Treating Methods

Biomimetic microchannels of planar reactors for optimized photocatalytic efficiency of water purification

Modelling of the flow-rate dependent partial thermal resistance of integrated microscale cooling structures

Contact Info

Product

Resources

About