Hierarchical growth of Cu zigzag microstrips on Cu foil for superhydrophobicity and corrosion resistance

Robust Ni/WC superhydrophobic surfaces by electrodeposition

“…Reported from previous study, stearic acid could be stable absorbed on the surface of several metals, such as gold, 38 silver, 39,40 copper, 40 nickel, 41 which indicate its application in fabrication of robust nickel-based composite coating. Liu et al fabricated copper surfaces with dual-scale roughness by etching 42 and electrodepositing 43 methods. Aer modied by steric acid, all of the surfaces showed excellent superhydrophobicity with contact angles ranging from 167 to 170 degrees.…”

“…Copper was slightly oxidized by SA indicated the SA molecular was immobilized on the surface, which decreased the surface energy. 43 In addition, compared with uorochemicals, stearic acid tends to more economical, environmentally-friendly than uorochemicals which are the most currently used in development of hydrophobic surfaces. The inert nature of SA also benets to maintain the surface resistance to coatings by forming inclusively a single assemble monolayer (SAM).…”

Hierarchically porous micro/nanostructured copper surfaces with enhanced antireflection and hydrophobicity

“…EIS is one of the most efficient and intensively used methods for investigation and prediction of corrosion protection [31,32]. Fig.…”

Influence of UV light irradiation on the corrosion behavior of electrodeposited Ni and Cu nanocrystalline foils

“…For realistic applications, it is vital to know the stability of Cu and Ni in different environments and corresponding mechanisms. The frequent corrosion mode of Cu and Ni is atmospheric corrosion, which has been broadly investigated [7][8][9][10][11][12][13][14] . Many studies on corrosion of Cu and Ni in NaCl solutions have also been carried out, since NaCl is one of important aggressive media, which has impact on corrosion of metals especially in ocean environment 9,10 .…”