Hierarchically porous micro/nanostructured copper surfaces with enhanced antireflection and hydrophobicity

Li, Ming; Su, Yanjie; Hu, Jing; Lu, Yao

doi:10.1016/j.apsusc.2015.10.217

Cited by 12 publications

(7 citation statements)

References 36 publications

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“…The water contact angle according to the Cassie model can be expressed as,

where

and

are the water contact angles of the rough and smooth surfaces, respectively.

and

are the fractional areas estimated for the solid and air contact points with the surface, respectively [ 29 ]. In this study, for the surface with nanostructures, the contact angles of the prepared copper surface with stearic acid modification and a smooth surface were

= 156.5° and

= 90.2°, respectively, as shown in Figure 7 .…”

Section: Resultsmentioning

confidence: 99%

Constructing Superhydrophobic Surface on Copper Substrate with Dealloying-Forming and Solution-Immersion Method

Sun

Wang

2022

Materials

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In this study, a superhydrophobic surface was constructed on a copper substrate through dealloying-forming and solution-immersion methods. The dealloying process for nanostructures on a copper surface involved the electrodeposition of zinc atoms, and the thermal alloying and chemical dealloying of zinc atoms. Then, a dealloyed copper surface was subsequently modified with low-surface-energy copper stearate to produce a superhydrophobic surface. Scanning electron microscopy, X-ray diffractometry, and Fourier transform infrared spectrometry were employed to characterize the morphological features and composition components of the surface in the fabrication process. The static contact angles of the copper surfaces were compared and evaluated based on various fabrication parameters, including electric current density, corrosive solution concentration, and nanostructures. The results indicated that a leaf-like copper stearate could be constructed through immersing a dealloyed copper plate into a 0.005 mol/L ethanol solution of stearic acid for 5 min. Nanostructures provided more attachment areas on the copper surface to facilitate the formation of copper stearate. The resulting as-prepared surface presented excellent superhydrophobic properties with a contact angle of over 156.5°, and showed the potential properties of non-sticking, self-cleaning, anti-corrosion, and stability. This study provides an efficient approach to fabricate superhydrophobic surfaces for engineering copper metals.

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“…The water contact angle according to the Cassie model can be expressed as,

where

and

are the water contact angles of the rough and smooth surfaces, respectively.

and

= 156.5° and

= 90.2°, respectively, as shown in Figure 7 .…”

Section: Resultsmentioning

confidence: 99%

Constructing Superhydrophobic Surface on Copper Substrate with Dealloying-Forming and Solution-Immersion Method

Sun

Wang

2022

Materials

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“…According to the mechanical interlocking theory of adhesion, the increased surface roughness allows the adhesive to flow into pores or irregularities. After curing, the adhesive acts like a bond or a lock with the substrate such that the adhesion strength enhances. , Therefore, the improvement in the adhesion strength between the substrate and the Cu foil after thermal processing is due to the formation of a specific morphology or texture. ,,,, …”

Section: Resultsmentioning

confidence: 99%

“…22,23 Therefore, the improvement in the adhesion strength between the substrate and the Cu foil after thermal processing is due to the formation of a specific morphology or texture. 4,6,19,20,24 The full-scan XPS spectrum of the remaining PI side from S-OM25-h is shown in Figure 6a. Compared with Figure 2a, more intense Ni and Cu signals were revealed from thermal-processed OM25.…”

Section: Effect Of Thermal Processing On Adhesionmentioning

confidence: 99%

“…Copper oxide (CuO) is considered a suitable material as the anti-reflection (AR) layer due to its black color. − By tuning the morphology of the AR layer or the interface layer, the adhesion of the AR layer to the substrate could be slightly improved. ,,, However, the low resistance of CuO to etching of the chemical solution during planarization is another issue . Nickel (Ni)-contained species exhibit better resistance to chemical corrosion and show improved adhesion to PI that are also considered potential AR materials. − …”

Section: Introductionmentioning

confidence: 99%

“…The materials applying for soft electronics are actively designed and investigated. Transparent polyimide (PI) is one of the candidate substrates for transparent flexible displays due to its excellent optical transmittance, high thermal stability, superior mechanical strength, low dielectric constant, and excellent chemical solvent resistance. − However, if the transparent PI was directly sputtered with copper (Cu), the electronic circuits on PI will be visible by the naked eyes due to the high reflectivity of Cu . Good adhesion between Cu and PI layers is another challenge for the printed circuits on flexible substrates. , …”

Section: Introductionmentioning

confidence: 99%

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Anti-reflection Layer-Sputtered Transparent Polyimide Substrate with Reliable Adhesion Strength to the Copper Layer

et al. 2023

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Parameters of DC-reactive magnetron sputtering are optimized to deposit anti-reflection (AR) layers on transparent polyimide (PI) substrates, followed by the deposition of the conductive copper layer, to fabricate practically reliable composite films as advanced flexible circuits. When the deposition thickness is controlled and the gas composition during sputtering is adjusted, the resultant AR layer-coated PI film exhibits low reflectance and reveals improved adhesion strength to the copper layer. The adhesion reliability tests confirm that the peel strength between the PI film and the deposited layers could be further improved after thermal processing due to the formation of a worm-like morphology for better mechanical interlocking with layers. The facile sputtering process successfully fabricates a reliable substrate material with low reflectance and sufficient adhesion strength to copper for application as flexible printed circuits.

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Approaches to design a surface with tunable wettability: a review on surface properties

2020

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Hierarchically porous micro/nanostructured copper surfaces with enhanced antireflection and hydrophobicity

Cited by 12 publications

References 36 publications

Constructing Superhydrophobic Surface on Copper Substrate with Dealloying-Forming and Solution-Immersion Method

Constructing Superhydrophobic Surface on Copper Substrate with Dealloying-Forming and Solution-Immersion Method

Anti-reflection Layer-Sputtered Transparent Polyimide Substrate with Reliable Adhesion Strength to the Copper Layer

Approaches to design a surface with tunable wettability: a review on surface properties

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