Abstract-We present an integrated heterostructure barrier varactor (HBV) frequency tripler on silicon substrate. The InGaAs/ InAlAs/ AlAs material structure was transferred onto the silicon wafer using low temperature plasma assisted bonding. The presented multiplier operates in the W-band (90-110 GHz). The module delivers 22.6 dBm, with a conversion loss of 6 dB, and 9 % 3-dB bandwidth.Index Terms-Frequency multipliers, heterostructure barrier varactors, heterogeneous integration, integrated circuits, millimeter-wave diodes, silicon, wafer bonding, III-V semiconductors.