Heterogeneous Integration Technique of Optoelectronic Dies to CMOS Circuits Via Metallic Bonding

Robogiannakis, P.; Kyriakis-Bitzaros, E.D.; Minoglou, K.; Katsafouros, S.; Kostopoulos, A.; Konstantinidis, G.; Halkias, G.

doi:10.1109/estc.2006.280020

Cited by 2 publications

(1 citation statement)

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“…Both, g and κ varied with location (coordinates x, y, and z). We have taken into account the temperature dependency κ(T ) ∼ T −1.4 [33] (originally estimated for GaN when T ranges 300-450 K) of each nitride layer in our calculations. Convection and radiation processes in semiconductor laser can usually be neglected [32], and are not taken into consideration.…”

Section: Modelmentioning

confidence: 99%

Impact of Heat Spreaders on Thermal Performance of III-N-Based Laser Diode

Kuc

Wasiak

Sarzaa

2015

IEEE Trans. Compon., Packag. Manufact. Technol.

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This paper explores the effect on optical output power of modifications to the package assembly of a blue-violet III-N-based p-down edge-emitting ridge-waveguide laser diode grown on bulk GaN crystal. The calculations were carried out using a 3-D self-consistent finite-element model. We focus on thermal analyses of the size and thermal conductivity of the heat spreader (mainly made of natural diamond and chemical vapor deposition diamond) and on the thickness of the solder. The results open the possibility for multiple increases in output power, due to a considerable increase in the power conversion efficiency of the laser diode.Index Terms-Computer aided analysis, semiconductor device packaging, semiconductor lasers.

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Section: Modelmentioning

confidence: 99%

Impact of Heat Spreaders on Thermal Performance of III-N-Based Laser Diode

Kuc

Wasiak

Sarzaa

2015

IEEE Trans. Compon., Packag. Manufact. Technol.

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High density Integrated Optoelectronic Circuits for High Speed Photonic Microsystems

Minoglou

Kyriakis-Bitzaros

Katsafouros

et al. 2007

2007 Ph.D Research in Microelectronics and Electronics Conference

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Abstract. The study of high density integrated optoelectronic circuits involves the development of hybrid integration technologies and the generation of models for the optoelectronic devices. To meet these goals, in the beginning a methodology for the heterogeneous integration of epitaxial GaAs wafers with fully processed standard bipolar complementary metal-oxide-semiconductor Si wafers is presented. The complete low-temperature wafer bonding process flow, based on SOG/SIO 2 , including procedures for the Si wafer planarization and GaAs substrate removal, has been developed and evaluated. The implementation of an in-plane optical link, consisting of an edge-emitting laser diode, a waveguide and a photodiode, is demonstrated. Further investigation on heterogeneous integration is achieved by presenting a second methodology. The integration of complete optoelectronic dies, consisting of optical sources and detectors connected by waveguides for the employment of a photonic layer above CMOS integrated circuits has been proposed. Photonic dies are integrated to CMOS circuits through a novel metallic bonding technique that utilizes a thin multilayer structure of the Au-20Sn eutectic alloy along with a starting layer of a rare earth element (Gd). Its main advantage is the accomplishment of mechanical bonding and electrical connectivity of the heterogeneous devices in a single step. The study of photonic microsystems demands also the modeling of specific OE devices. Under this scope, an efficient model scheme that combines the non-linear behavior of the input parasitics with the intrinsic fundamental device rate equations of the Vertical Cavity Surface Emitting Lasers (VCSELs) is proposed. A systematic methodology for the model parameter extraction from dc and ac, electrical and optical measurements, is also presented and simulation results are compared with the experimental measurements. Extraction and simulation procedures are implemented in commercial integrated circuit design tools and they are proved to be very fast while they preserve adequate accuracy.

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Heterogeneous Integration Technique of Optoelectronic Dies to CMOS Circuits Via Metallic Bonding

Cited by 2 publications

References 20 publications

Impact of Heat Spreaders on Thermal Performance of III-N-Based Laser Diode

Impact of Heat Spreaders on Thermal Performance of III-N-Based Laser Diode

High density Integrated Optoelectronic Circuits for High Speed Photonic Microsystems

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