2017 IEEE Aerospace Conference 2017
DOI: 10.1109/aero.2017.7943645
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Heterogeneous high performance computing modules for next generation onboard processing

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Cited by 3 publications
(2 citation statements)
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“…Nowadays state-of-the-art reliable designs in aerospace applications either employ special-purpose radiation-hardened chips [4], [5], which are much slower than commercial ones, or rely on traditional duplication/triplication of the system and on a bit-wise comparison of the produced results [6], [7]. In all cases, the incurred performance degradation is significant.…”
Section: Introductionmentioning
confidence: 99%
“…Nowadays state-of-the-art reliable designs in aerospace applications either employ special-purpose radiation-hardened chips [4], [5], which are much slower than commercial ones, or rely on traditional duplication/triplication of the system and on a bit-wise comparison of the produced results [6], [7]. In all cases, the incurred performance degradation is significant.…”
Section: Introductionmentioning
confidence: 99%
“…Over the past few years, there has been a significant increase in number of satellites launched into space. To enhance the success rate for satellites to complete their critical mission, one of the key considerations is the onboard data processing capabilities [1]- [2]. This has led to using high performance digital signal processors (DSPs) which are unfortunately highly sensitive to radiation-induced soft errors [3].…”
Section: Introductionmentioning
confidence: 99%