INTRODUCTIONThe second generation of infrared detectors based on HgCdTe is today a mature technology used in production in several companies in the world. In France, Sofradir, which industrializes HgCdTe IRCMOS infrared detectors, uses a technology transferred by CEA/LETI/Infrared Laboratory several years ago.This technology is based 11 on the very simple approach of planar n-on-p ion-implanted photodiodes. HgCdTe is grown by liquid-phase epitaxy (LPE) on the Te-rich corner by the slider technique. Detector array interconnection to silicon readout integrated circuit (ROIC) is made by hot welding with indium bumps.From that time, this technology was continuously improved by LETI and Sofradir teams. Research conducted at LETI in collaboration with Sofradir in the last few years has led to new achievements. This includes improvements of the standard technology and development of new advanced technologies.For the standard technology, progress in the field of crystal growth was obtained increasing the size and the quality of CdZnTe (4-in. ingots) and HgCdTe LPE (20 cm 2 ) crystals. In the field of detector technology, reduction of the detector pitch (20 m) allowed array size increase (up to 640 × 512). Most of these improvements are already available at Sofradir.New advanced technologies undertaken at the Infrared Laboratory have led to feasibility demonstrations of advanced focal plane arrays. Some of them are presented in this paper.
MEDIUM-WAVELENGTH INFRARED MULTICOLOR IRCMOS FOCAL PLANE ARRAYSIn the last few years, the interest in dual-band HgCdTe infrared photo-detectors has widely grown. A wide range of civilian (earth observation, meteorology) and military (target discrimination, background clutter rejection) applications exists for this type of component. For these reasons, a lot of work has beenIn this article, we present recent developments of the research in France at LETI infrared laboratory in the field of complex third-generation HgCdTe IRC-MOS focal plane arrays (FPAs). We illustrate this with three prototypes of FPAs made at LETI, which have involved some technological improvements from the standard process today in production at Sofradir. We present, using molecularbeam epitaxy (MBE) growth, a 128 × 128 dual-band infrared (photodetector)-complementary metal oxide semiconductor (IRCMOS) with a pitch of 50 m operating within 2-5 m. Using the more conventional liquid-phase epitaxy (LPE) growth, we show a new generation of high-performance long linear arrays (1500 × 2; pitch, 30 m) operating in medium-wavelength infrared (MWIR) or long-wavelength infrared (LWIR) bands based on a modular architecture of butted HgCdTe detection circuit and SiCMOS multiplexers. Finally, we present for the first time a megapixel (1000 × 1000) FPA with a pitch of 15 m operating in the MWIR band that exhibits a very high performance and pixel operability.