Heat transport enhancement of heat sinks using Cu-coated graphene composites

Hsieh, Chien‐Te; Lee, Cheng-En; Chiang, Yu-Ming; Hsieh, Keng-Yen; Wu, Ho-Sheng

doi:10.1016/j.matchemphys.2017.05.012

Cited by 18 publications

(8 citation statements)

References 40 publications

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“…As early as 2003, Norley et al [85] has proposed a graphite composite heat sink with anisotropic heat conduction. In recent years, Hsieh et al [86] Many factors affect the thermal performance of graphene-polymer composites, one of which is morphology. Chu et al [88] observed an enhancement of TC in two types of wrinkled GNPs and introduced the waviness factor to analyze TC affecting by waviness effect.…”

Section: Graphene Composite Materialsmentioning

confidence: 99%

Filling the gap: thermal properties and device applications of graphene

Zhu

Zhao

et al. 2021

Sci. China Inf. Sci.

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With the miniaturization and integration of electronic devices, the heat dissipation problems caused by higher power density are getting more serious, limiting the development of integrated circuits industry. Graphene, as a representative of two-dimensional materials, has attracted extensive attention for its excellent thermal properties. Ever since it has been discovered, researches have been carried out and achievements have been made both theoretically and practically. Here, we review the established theories and simulation system for 2D heat conduction, different measurement methods for thermal conductivity and graphene's device applications. We propose two gaps between different scales and between theoretical prediction and practical effect. Owing to the higher heat dissipation requirements and the endless pursuit of better thermal performance, it is challenging but critical to continue studying and further understand the thermal properties of graphene. Challenges and opportunities are both emphasized. It is hoped that the diversification and progress in morphology and manufacturing technology can bring new development and that graphene can eventually be widely used and make huge changes to micoelectronic industry.

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Section: Graphene Composite Materialsmentioning

confidence: 99%

Filling the gap: thermal properties and device applications of graphene

Zhu

Zhao

et al. 2021

Sci. China Inf. Sci.

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“…8,9 In the latter case, the coupling of the photocatalytic element to a photovoltaic cell produced a particularly efficient and inexpensive set. 10 Applications for thermal management issues deserve special mention, for example as thermal interface materials (TIM), heat sinks and heat spreaders, intended for a rapid dissipation of the heat produced in highly-packed integrated circuits, [11][12][13] and also, as heat transfer coatings for effective heat dissipation in industrial boilers via phase change heat transfer. 14 For many of the above applications, the interfacial characteristics between copper and graphene along with the particular microstructural arrangement, e.g.…”

Section: Introductionmentioning

confidence: 99%

“…Copper/graphene composites and heterostructures result in appealing materials for a variety of applications, which include their utilization for energy production and storage, typically as electrodes in supercapacitors and Li-ion batteries − but also as back electrodes in halide perovskite solar cells where a Cu-based interface favors transport from the perovskite side to the carbon electrode. , Equally interesting are their uses as highly selective electrocatalytic biosensors for the detection of dopamine neurotransmitters and essential human aminoacids , or as electro- and photocatalysts for the transformation of CO 2 into hydrocarbons. , In the latter case, the coupling of the photocatalytic element to a photovoltaic cell produced a particularly efficient and inexpensive set . Applications for thermal management issues deserve special mention, for example, as thermal interface materials (TIM), heat sinks and heat spreaders, intended for a rapid dissipation of the heat produced in highly packed integrated circuits, − and also as heat transfer coatings for effective heat dissipation in industrial boilers via phase change heat transfer …”

Section: Introductionmentioning

confidence: 99%

Remarkable Effects of an Electrodeposited Copper Skin on the Strength and the Electrical and Thermal Conductivities of Reduced Graphene Oxide-Printed Scaffolds

Moyano

García

Damborenea

et al. 2020

ACS Appl. Mater. Interfaces

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Architected Cu/rGO (reduced graphene oxide) heterostructures are achieved by electrodepositing copper on filament printed rGO scaffolds. The Cu coating perfectly contours the printed rGO structure, but isolated Cu particles also permeate inside the filaments. Although the Cu deposition conveys certain mass augment, the 3D structures remain reasonably light (bulk density  0.42 g cm -3 ). The electrical conductivity (e) of the Cu/rGO structure (8 x 10 4 S•m -1 ) shows a notable increment compared to e of the rGO structure (4 x 10 2 S•m -1 ). The effect on the scaffold robustness is also notable with an increase of the compressive strength by nearly ten times (from 20 kPa of the rGO scaffold to 150 kPa of the Cu/rGO structure) and cyclability as well. The improved thermal conductivity of the Cu coated scaffolds (4 times higher), in addition the e and strength improvements, suggests that 3D Cu/rGO structures could be suitable assemblies for integration into thermal dissipation systems, particularly as thermal interface materials, for compact electronic devices.

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“…Among all of these properties, this study interest improving the thermal conductivity of copper using graphene [2], [8]. Heat transport in graphene dominated by phonons and affected by the length of phonon mean free path (PMFP) that is about ~600nm near room temperature [9]. Thus, it gives graphene unique thermal properties.…”

Section: Introductionmentioning

confidence: 99%

“…As a result of that graphene-coated copper and calculate thermal conductivity of graphenecoated materials become a hot topic. Thus, researchers have studied graphene synthesis on copper to show the applicability of the new material [9]- [12]. After the graphene synthesis is obtained as a single layer/multilayer or coated on copper, some works have done to calculate thermal conductivity experimentally [2], [13]- [21].…”

Section: Introductionmentioning

confidence: 99%

Molecular Dynamics Study of the Thermal Conductivity of Graphene Coated Copper

Toprak¹,

Ersavaş²

2019

Proceedings of the 5th World Congress on Mechanical, Chemical, and Material Engineering

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In this study, the thermal conductivity of various size of pure copper, pure graphene and, different number of layer graphene coated copper models are studied using non-equilibrium molecular dynamics (NEMD) simulations. Our findings show that the thermal conductivity of graphene coated copper is higher than the uncoated ones. Furthermore, results also indicate that single layer graphene (SLG) model has the highest thermal conductivity as compared to the other model. Even though multiple layer graphene (MLG) has lower thermal conductivity value compare to SLG, this study shows that the thermal conductivity of MLG coated copper has higher thermal conductivity than SLG coated one. The most important finding in this study suggests that the thermal conductivity of copper can be improved using high thermal conductivity materials like graphene.

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Heat transport enhancement of heat sinks using Cu-coated graphene composites

Cited by 18 publications

References 40 publications

Filling the gap: thermal properties and device applications of graphene

Filling the gap: thermal properties and device applications of graphene

Remarkable Effects of an Electrodeposited Copper Skin on the Strength and the Electrical and Thermal Conductivities of Reduced Graphene Oxide-Printed Scaffolds

Molecular Dynamics Study of the Thermal Conductivity of Graphene Coated Copper

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