Filling the gap: thermal properties and device applications of graphene

Abstract

With the miniaturization and integration of electronic devices, the heat dissipation problems caused by higher power density are getting more serious, limiting the development of integrated circuits industry. Graphene, as a representative of two-dimensional materials, has attracted extensive attention for its excellent thermal properties. Ever since it has been discovered, researches have been carried out and achievements have been made both theoretically and practically. Here, we review the established theories and simulation system for 2D heat conduction, different measurement methods for thermal conductivity and graphene's device applications. We propose two gaps between different scales and between theoretical prediction and practical effect. Owing to the higher heat dissipation requirements and the endless pursuit of better thermal performance, it is challenging but critical to continue studying and further understand the thermal properties of graphene. Challenges and opportunities are both emphasized. It is hoped that the diversification and progress in morphology and manufacturing technology can bring new development and that graphene can eventually be widely used and make huge changes to micoelectronic industry.

Manipulating Interfacial Thermal Conduction of 2D Janus Heterostructure via a Thermo‐Mechanical Coupling

“…[32] In 2D electronic and optoelectronic devices with single-atom thickness, the heat production in the confined volume will always result in local hotspots which are becoming crucial for high-power-density chips because the enhanced local temperature causes degradation in the lifespan of devices. [33] Therefore, the thermal conductivities of 2D materials have attracted extensive attention in recent years. [34,35] Great effort has been done to understand the various effects on thermal transport properties of 2D materials, including size effect, [36] strain effect, [37] defect effect, [38] and substrate dependence.…”

High Thermal Conductivity 2D Materials: From Theory and Engineering to Applications

“…Moreover, hBN is thermally and chemically stable, as it will not decompose at 1000 °C in air, 1400 °C in vacuum, or 2800 °C in an inert atmosphere. [ 28 ] At the same time, compared with Cu, bulk hBN has almost the same κ value (400 W m –1 K –1 ) with a lower mass density, which leads to broad application prospects in heat‐dissipation in electronic devices.…”

“…Recently, some reviews have also focused on 2D materials for thermal management. [28][29][30] For example, ref. [29] summarized graphene thermal-management materials according to different fabrication methods and discussed various characterization technologies.…”

Impact of Atomic Coating on Thermal Conductivity of Nano Materials

“…On the one hand, different from three-dimensional bulk materials, novel thermal transport phenomena are reported in low-dimensional nanostructures, including the remarkable size dependence in thermal conductivity [1][2][3][4][5], and phonon hydrodynamics transport characteristic including second sound and phonon Poiseuille flow [6][7][8][9][10]. In addition to the importance in fundamental physics, the study of thermal conduction in nano materials is critical for applications including thermoelectrics [11,12], and thermal management in nanoscale integrated devices [13][14][15][16]. In thermal management, high thermal conductivity materials have promising application potential.…”