Heat transfer performance of lotus-type porous copper heat sink with liquid GaInSn coolant

Liu, Y.; Chen, H.F.; Zhang, H.W.; Li, Y.X.

doi:10.1016/j.ijheatmasstransfer.2014.09.058

Cited by 45 publications

(14 citation statements)

References 21 publications

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“…Lotus-type structures can be possible solutions for cooling i.e., as heat sinks [1,2]. As shown in Figure 17, for this application a copper plate is joined parallel to the pores on a lotus-type structure.…”

Section: Application Of Lotus-type Structuresmentioning

confidence: 99%

“…In the last two decades, porous metals were tested for mechanical and thermal applications. Especially open porous metals, like metal foam, lotus-type structures, and metal fiber structures attracted much interest for thermal applications [1][2][3][4][5]. Therefore, they were experimentally tested e.g., as heat exchanger material replacing conventional fins.…”

Section: Introductionmentioning

confidence: 99%

“…Section of a lotus-type porous copper ingot. Reproduced from[2], with permission from Elsevier, 2015.…”

mentioning

confidence: 99%

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Strongly Orthotropic Open Cell Porous Metal Structures for Heat Transfer Applications

Fink

Andersen

Seidel

et al. 2018

Metals

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For modern thermal applications, open cell porous metals provide interesting opportunities to increase performance. Several types of cellular metals show an anisotropic morphology. Thus, using different orientations of the structure can boost or destroy the performance in thermal applications. Examples of such cellular anisotropic structures are lotus-type structures, expanded sheet metal, and metal fiber structures. Lotus-type structures are made by casting and show unidirectional pores, whereas expanded sheet metal structures and metal fiber structures are made from loose semi-finished products that are joined by sintering and form a fully open porous structure. Depending on the type of structure and the manufacturing process, the value of the direction-dependent heat conductivity may differ by a factor of 2 to 25. The influence of the measurement direction is less pronounced for the pressure drop; here, the difference varies between a factor of 1.5 to 2.8, depending on the type of material and the flow velocity. Literature data as well as own measurement methods and results of these properties are presented and the reasons for this strongly anisotropic behavior are discussed. Examples of advantageous applications, for example a latent heat storage device and a heat exchanger, where the preferential orientations are exploited in order to gain the full capacity of the structure’s performance, are introduced.

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Section: Application Of Lotus-type Structuresmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Strongly Orthotropic Open Cell Porous Metal Structures for Heat Transfer Applications

Fink

Andersen

Seidel

et al. 2018

Metals

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show abstract

“…Another way is to change the material of the heat sink, including the fins and substrate [ 13 , 14 ]. Porous medias such as micro tubes [ 15 , 16 ], sintered metal [ 17 , 18 ] and metal foam [ 19 , 20 ] are very popular fin materials in research because they have very large convection area. The orientation direction of the heat sink in application [ 21 , 22 ] and airflow condition [ 23 , 24 ] were also found to have impact on cooling efficiency.…”

Section: Introductionmentioning

confidence: 99%

Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices

You

Zhang

Tao³

et al. 2021

Micromachines

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Heat sinks are widely used in electronic devices with high heat flux. The design and build of microstructures on heat sinks has shown effectiveness in improving heat dissipation efficiency. In this paper, four kinds of treatment methods were used to make different microstructures on heat sink surfaces, and thermal radiation coating also applied onto the heat sink surfaces to improve thermal radiation. The surface roughness, thermal emissivity and heat dissipation performance with and without thermal radiation coating of the heat sinks were studied. The result shows that with an increase of surface roughness, the thermal emissivity can increase up to 2.5 times. With thermal radiation coating on a surface with microstructures, the heat dissipation was further improved because the heat conduction at the coating and heat sink interface was enhanced. Therefore, surface treatment can improve the heat dissipation performance of the heat sink significantly by enhancing the thermal convection, radiation and conduction.

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“…Recently, porous metal interlayers have been widely used in various engineering designs such as cooling electronic systems and in aerospace facilities due to its porosity, thermal conductivity and usage efficiency [14][15][16]. The pores in the porous metal interlayer is reported to assist during the residual stress absorption, which endows this unique feature a remarkable advantage for metal joining applications [17].…”

Section: Introductionmentioning

confidence: 99%

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

Jamadon

Tan

Yusof

et al. 2016

Metals

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Abstract:The joining of lead-free Sn-3.0Ag-0.5Cu (SAC305) solder alloy to metal substrate with the addition of a porous Cu interlayer was investigated. Two types of porous Cu interlayers, namely 15 ppi-pore per inch (P15) and 25 ppi (P25) were sandwiched in between SAC305/Cu substrate. The soldering process was carried out at soldering time of 60, 180, and 300 s at three temperature levels of 267, 287, and 307 • C. The joint strength was evaluated by tensile testing. The highest strength for solder joints with addition of P25 and P15 porous Cu was 51 MPa (at 180 s and 307 • C) and 54 MPa (at 300 s and 307 • C ), respectively. The fractography of the solder joint was analyzed by optical microscope (OM) and scanning electron microscopy (SEM). The results showed that the propagation of fracture during tensile tests for solder with a porous Cu interlayer occurred in three regions: (i) SAC305/Cu interface; (ii) inside SAC305 solder alloy; and (iii) inside porous Cu. Energy dispersive X-ray spectroscopy (EDX) was used to identify intermetallic phases. Cu 6 Sn 5 phase with scallop-liked morphology was observed at the interface of the SAC305/Cu substrate. In contrast, the scallop-liked intermetallic phase together with more uniform but a less defined scallop-liked phase was observed at the interface of porous Cu and solder alloy.

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Heat transfer performance of lotus-type porous copper heat sink with liquid GaInSn coolant

Cited by 45 publications

References 21 publications

Strongly Orthotropic Open Cell Porous Metal Structures for Heat Transfer Applications

Strongly Orthotropic Open Cell Porous Metal Structures for Heat Transfer Applications

Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

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