Heat transfer enhancement on a microchannel heat sink with impinging jets and dimples

Huang, Xiaoming; Yang, Wei; Ming, Tingzhen; Shen, Wenqing; Yu, Xueli

doi:10.1016/j.ijheatmasstransfer.2017.04.078

Cited by 115 publications

(24 citation statements)

References 37 publications

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“…Dimple structure design development of an MCHS is important as dimple could increase or decrease the overall performance of the MCHS. Huang et al [103] studied the effect of various shapes of dimples on the fluid flow and heat transfer characteristics in an impinging jet microchannel where convex dimple showed the highest performance enhancement compared to mixed dimples and concave dimple. The presence of convex dimple structure decreased the flow resistance in the microchannel resulting in a lower pumping power consumption.…”

Section: Mchs With Hybrid Passive Methodsmentioning

confidence: 99%

A review of passive methods in microchannel heat sink application through advanced geometric structure and nanofluids: Current advancements and challenges

Japar

Sidik

Saidur

et al. 2020

Nanotechnology Reviews

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Microchannel heat sink (MCHS) is an advanced cooling technique to fulfil the cooling demand for electronic devices installed with high-power integrated circuit packages (microchips). Various microchannel designs have been innovated to improve the heat transfer performance in an MCHS. Specifically, the utilisation of nanotechnology in the form of nanofluid in an MCHS attracted the attention of researchers because of considerable enhancement of thermal conductivity in nanofluid even at a low nanoparticle concentration. However, a high-pressure drop was the main limitation as it controls the MCHS performance resulted from heat transfer augmentation. Therefore, this study aimed to critically summarise the challenges and limitations of both single and hybrid passive methods of MCHS. Furthermore, the performance of nanofluid as a coolant in the MCHS as affected by the type and concentration of nanoparticle and the type of base fluid was reviewed systematically. The review indicated that the hybrid MCHS provides a better cooling performance than MCHS with the single passive method as the former results in a higher heat transfer rate with minimal pressure drop penalty. Besides that, further heat transfer performance can be enhanced by dispersing aluminium dioxide (Al2O3) nanoparticles with a concentration of less than 2.0% (v/v) in the water-based coolant.

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Section: Mchs With Hybrid Passive Methodsmentioning

confidence: 99%

A review of passive methods in microchannel heat sink application through advanced geometric structure and nanofluids: Current advancements and challenges

Japar

Sidik

Saidur

et al. 2020

Nanotechnology Reviews

View full text Add to dashboard Cite

show abstract

“…This table and the figure bear cross referencing. Huang et al [105] considered convex, concave and mixed dimples on the bottom wall, flow inlets at the top in the form of impinging jets on the bottom wall structures and outlets at both ends of the rectangular basic channels. The highest Nu was obtained for convex dimples followed by channels without dimples, with mixed dimples and with concave dimples.…”

Section: Dimples and Protrusionsmentioning

confidence: 99%

A review of liquid flow and heat transfer in microchannels with emphasis to electronic cooling

2019

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Since the realization of microchannel devices more than three and half decades ago with water as the cooling fluid providing heat transfer enhancement, significant progress has been made to improve the cooling performance. Thermal management for electronic devices with their ever-widening user profile remains the major driving force for performance improvement in terms of miniaturisation, long-term reliability, and ease of maintenance. The ever-increasing requirement of meeting higher heat flux density in more compact and powerful electronic systems calls for further innovative solutions. Some recent studies indicate the promise offered by processes with phase change and the use of active devices. But their adoption for electronic cooling still weighs unfavourably against long-term fluid stability and simplicity of device profile with moderate to high heat transfer capability. Applications and reviews of these promising research trends have been briefly visited in this work. The main focus of this review is the flow and heat transfer regime related to electronic cooling in evolving channel forms, whose fabrication are being enabled by the significant advancement in micro-technologies. Use of disruptive wall structures like ribs, cavities, dimples, protrusions, secondary channels and other interrupts along with smooth-walled channels with curved flow passages remain the two chief geometrical innovations envisaged for these applications. These innovations target higher thermal enhancement factor since this implies more heat transfer capability for the same pumping power in comparison with the corresponding straight-axis, smooth-wall channel configuration. The sophistication necessary to deal with the experimental uncertainties associated with the micron-level characteristic length scale of any microchannel device delayed the availability of results that exhibited acceptable matching with numerical investigations. It is indeed encouraging that the experimental results pertaining to simple smooth channels to grooved, ribbed and curved microchannels without unreasonable increase in pumping power have shown good agreement with conventional numerical analyses based on laminar-flow conjugate heat-transfer model with no-slip boundary condition. The flow mechanism with the different disruptive structures like dimple, cavity and rib, fin and interruption, vortex generator, convergingdiverging side walls or curved axis are reviewed to augment the heat transfer. While the disruptions cause heat transfer enhancement by interrupting the boundary layer growth and promoting mixing by the shed vortices or secondary channel flow, the flow curvature brings in enhancement by the formation of secondary rolls culminating into chaotic advection at higher Reynolds number. Besides these revelations, the numerical studies helped in identifying the parameter ranges, promoting a particular enhancement mechanism. Also, the use of modern tools like Poincare section and the analysis of flow bifurcation leading to chaotic advection is discussed....

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“…Instead of using water or the aircooling method, a multi-concept cooling method [61] involved three passive cooling techniques of conductive cooling, water passive cooling, and aluminium heat sink could reduce the surface of the PV module to around 20°C. It demonstrated the hybrid [62,63] use of different cooling methods.…”

Section: Introductionmentioning

confidence: 99%

Enhancing performance of photovoltaic panel by cold plate design with guided channels

Chin¹,

Gao²,

Han³

et al. 2020

IET Renewable Power Generation

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Photovoltaic (PV) panel is subjected to high temperatures from solar radiation. The performance of the PV panel deteriorates as the PV's operating temperature increases. This study aims to examine the cooling method using a cold plate attached to the PV panel to lower its operating temperature. The cold plate consists of several guided channels or ribbed walls of thickness 0.015 m to direct the circulating water flow from its entrance to the exit point at the back of the PV panel. The experiment demonstrates a decrease of around 21.2°C in surface temperature and improves ∼2% in electrical efficiency, 8% in thermal efficiency and 1.6% in PV panel efficiency as compared to PV panel without a cooling system. The relationship between the average PV's surface temperature and output power is obtained. The uncertainty analysis shows that the average standard deviation in PVs, electrical and thermal efficiency is not more than 1.26% when subjected to differences in the day of measurements, mass flow rate, and pressure of the pump.

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Heat transfer enhancement on a microchannel heat sink with impinging jets and dimples

Cited by 115 publications

References 37 publications

A review of passive methods in microchannel heat sink application through advanced geometric structure and nanofluids: Current advancements and challenges

A review of passive methods in microchannel heat sink application through advanced geometric structure and nanofluids: Current advancements and challenges

A review of liquid flow and heat transfer in microchannels with emphasis to electronic cooling

Enhancing performance of photovoltaic panel by cold plate design with guided channels

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