Heat Dissipation Technology of IGBT Module Package

Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides a brief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, and techniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy, are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solder particle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creep recovery behaviour of pastes.

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Effect of Interface on Thermal Conductivity of Clad Metal through Thickness Direction for Heat Sink

Kim¹,

Kim²,

Kim³

et al. 2015

Journal of the Microelectronics and Packaging Society

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Heat Dissipation Technology of IGBT Module Package

Cited by 3 publications

References 21 publications

Thermal-flow Analysis for Inverter-type Arc Welding Machine

Thermal-flow Analysis for Inverter-type Arc Welding Machine

Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications

Effect of Interface on Thermal Conductivity of Clad Metal through Thickness Direction for Heat Sink

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