Hardness measurement of CVD diamond coatings on SiC substrates

Chowdhury, S.; Barra, Eamonn De; Laugier, M. T.

doi:10.1016/j.surfcoat.2004.08.131

Cited by 27 publications

(15 citation statements)

References 21 publications

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“…The small indent size, high brittleness, and high elastic recovery make the diagonals measurement difficult and not reliable under optical microscopy [1]. Moreover, the tip of a Vickers indenter is damaged after several tests.…”

Section: Introductionmentioning

confidence: 99%

“…It was reported, that the hardness of such materials is much higher than that of diamond [5] and cBN [6][7][8][9] single crystals. Contemporary imaging techniques, such as 3D optical microscopy [10], laser scanning microscopy [11], and atomic force microscopy (AFM) [1,3,12] were used to improve the precision of indent size measurements in superhard materials. However, it was also very difficult to measure the indent sizes due to the cracking within, and around, the contact sites [1,13].…”

Section: Introductionmentioning

confidence: 99%

“…superhard materials. However, it was also very difficult to measure the indent sizes due to the cracking within, and around, the contact sites [1,13].…”

Section: Introductionmentioning

confidence: 99%

“…Earlier, micro-Raman spectroscopy showed that a pressure-induced phase transformation of diamond to disordered graphite occurs during hardness tests of diamond single crystals [22,23]. For measuring the indent sizes on the surface of diamond in the above-mentioned papers [1,3,12], the ordinary AFM in topography operating mode was used, which characterized the surface relief only. In the present paper, AFM in the phase contrast mode was used to reveal the graphite layer formed in the Vickers indent in diamond and to measure its area.…”

Section: Introductionmentioning

confidence: 99%

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Vickers Hardness of Diamond and cBN Single Crystals: AFM Approach

et al. 2017

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Atomic force microscopy in different operation modes (topography, derivative topography, and phase contrast) was used to obtain 3D images of Vickers indents on the surface of diamond and cBN single crystals with high spatial resolution. Confocal Raman spectroscopy and Kelvin probe force microscopy were used to study the structure of the material in the indents. It was found that Vickers indents in diamond has no sharp and clear borders. However, the phase contrast operation mode of the AFM reveals a new viscoelastic phase in the indent in diamond. Raman spectroscopy and Kelvin probe force microscopy revealed that the new phase in the indent is disordered graphite, which was formed due to the pressure-induced phase transformation in the diamond during the hardness test. The projected contact area of the graphite layer in the indent allows us to measure the Vickers hardness of type-Ib synthetic diamond. In contrast to diamond, very high plasticity was observed for 0.5 N load indents on the (001) cBN single crystal face. Radial and ring cracks were absent, the shape of the indents was close to a square, and there were linear details in the indent, which looked like slip lines. The Vickers hardness of the (111) synthetic diamond and (111) and (001) cBN single crystals were determined using the AFM images and with account for the elastic deformation of the diamond Vickers indenter during the tests.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

“…superhard materials. However, it was also very difficult to measure the indent sizes due to the cracking within, and around, the contact sites [1,13].…”

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Vickers Hardness of Diamond and cBN Single Crystals: AFM Approach

et al. 2017

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“…Other techniques that are often employed for measuring hardness of substances are developed by Rockwell [72], Brinell [72], Knoop, and Vickers [73]. Over the years, more quantitative methods such as nanoindentation [74] have been developed. This technique applies a small and a controllable load on to the substrate with a probe.…”

Section: Hardnessmentioning

confidence: 99%

Key Chemical Components in Metal CMP Slurries

Cheemalapati

Keleher

2007

Microelectronic Applications of Chemical Mechanical Planarization

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Chemical-mechanical planarization (CMP) slurries can be classified into two general categories according to their applications: metal CMP slurry and nonmetal CMP slurry. Two most important metals incorporated into IC chip manufacturing via CMP are W and Cu. Depending upon integration schemes, a metal CMP slurry may or may not carry out the function of removing the film(s) immediately below the overburden metal such as cap, adhesion, and barrier layers. For tungsten CMP, a single-step slurry is typically used to remove both excess tungsten and its barrier/adhesion layer. For copper CMP, after the removal of copper, a subsequent barrier removal step is often required. This chapter reviews the basic requirements for the key components found in common metal slurries.It is generally understood that a metal CMP slurry chemically modifies the surface to be polished and yields a softer and porous complex layer, which is then removed by mechanical force in the process. Although these metals may differ in their physical and chemical properties, the underlying principle for the design of slurries is the same. A production-worthy metal CMP slurry must address several issues, such as material removal rate (MRR), within-wafer nonuniformity (WIWNU), step height reduction efficiency, dishing/erosion, minimum ILD loss, corrosion, scratching, slurry residue, and other surface defects. Typical metal CMP slurry may contain an oxidant, a chelating agent, abrasive particles, a surfactant, and other additives. These components must work in concert to produce adequate material removal rate, high planarization efficiency, and Microelectronic Applications of Chemical Mechanical Planarization, Edited by Yuzhuo Li

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Superhard Materials: Advances in the Search and Synthesis of New Materials

Pangilinan

Akopov

et al. 2021

Encyclopedia of Inorganic and Bioinorganic Chemistry

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Materials with superior hardness can be categorized as ultrahard (Vickers hardness, H v ≥ 80 GPa) and superhard ( H v ≥ 40 GPa). These materials are commonly used as cutting tools and abrasives in the machining and manufacturing industries. With its extreme hardness, diamond is the best known and most used ultrahard material for industrial applications. However, it is ineffective at cutting and drilling ferrous alloys due to diamond's high reactivity with iron and poor thermal stability in air. Additionally, the synthesis of diamond requires both high pressure (HP) and high temperature, making it an expensive process. These limitations have driven the search for alternative superhard materials that are capable of cutting steels and other materials at lower costs. This article reviews the concept of hardness and summarizes advancements in the synthesis and mechanical properties of hard materials. It begins with a review of methods to measure hardness, adding HP diffraction methods to more conventional hardness measurements. It then considers new ultrahard materials that exist within the B–C–N ternary system, with hardness approaching diamond but improved chemical stability. Finally, it surveys superhard nitrides, oxides, and borides as potential alternative materials, focusing on transition metal boride systems where the synthesis can be readily achieved at ambient pressure and scaled for industrial applications. We hope that this article serves as an overview of hard materials and guide for the comparison of data reported in the literature.

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Hardness measurement of CVD diamond coatings on SiC substrates

Cited by 27 publications

References 21 publications

Vickers Hardness of Diamond and cBN Single Crystals: AFM Approach

Vickers Hardness of Diamond and cBN Single Crystals: AFM Approach

Key Chemical Components in Metal CMP Slurries

Superhard Materials: Advances in the Search and Synthesis of New Materials

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