Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019 2019
DOI: 10.1117/12.2514685
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Half-pitch 14nm direct patterning with nanoimprint lithography

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Cited by 4 publications
(6 citation statements)
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“…Repeated use of the stamp accumulates damage in multiple areas as shown in Figure S7b, and the stamp is eventually no longer usable. The recyclability of the stamp is very low compared to NIL, where hundreds of thousands of use repetitions have been demonstrated through long-standing studies by academy and industry . To enhance the recyclability of the stamp, the structure of the stamp should be more rigid, and a precision imprinting tool with vibration isolation is also needed to fine-tune the contact between the anodic stamp and semiconductor substrates.…”
Section: Results and Discussionmentioning
confidence: 99%
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“…Repeated use of the stamp accumulates damage in multiple areas as shown in Figure S7b, and the stamp is eventually no longer usable. The recyclability of the stamp is very low compared to NIL, where hundreds of thousands of use repetitions have been demonstrated through long-standing studies by academy and industry . To enhance the recyclability of the stamp, the structure of the stamp should be more rigid, and a precision imprinting tool with vibration isolation is also needed to fine-tune the contact between the anodic stamp and semiconductor substrates.…”
Section: Results and Discussionmentioning
confidence: 99%
“…In this background, nanoimprint lithography (NIL) has attracted attention as an alternative lithography technique. A stamp with predefined patterns imprints a fluidic polymer under UV illumination or thermal treatment. After the NIL process, a mirror symmetrical pattern of the stamp is formed on the imprinted polymer.…”
mentioning
confidence: 99%
“…Moreover, it gives precise control over the energy and dose of the electron beam, as well as accurate registration over small areas on a wafer and lower defect densities [64]. However, the application of EBL is constrained by its slow exposure speed, high cost, and resolution limitations caused by electron beam diffraction in solids [64,74].…”
Section: Electron Beam Lithographymentioning
confidence: 99%
“…As shown in Figure 2, NIL has several advantages such as high resolution of 1D patterning, high pattern fidelity of 2D patterning, and fine 3D patterning. [1][2] We have developed both, a Jet and Flash Imprint Lithography (J-FIL) and Spin-Coating and Flash Imprint Lithography (SC-FIL) for 2D patterning. [3][4] The performance is shown in Table 1.…”
Section: Introductionmentioning
confidence: 99%