2007
DOI: 10.1016/j.microrel.2007.03.008
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Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling

Abstract: Growth behavior of tin whiskers from pure tin and tin-bismuth plated leadframe (LF) packages for elevated temperature and high humidity storages and during thermal cycling was observed. In the storage at 60°C/93% relative humidity (RH) and 85°C/85%RH the galvanic corrosion occurred at the outer lead toes and shoulders where the base LF material is exposed, forming tin oxide layers of SnO 2 . The corroded layers spread inside the film and formed whiskers around the corroded islands. Many whiskers were observed … Show more

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Cited by 13 publications
(2 citation statements)
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“…2 shows one of the experimental results. The whisker-like formation (Sample 4) is compared with an image from the literature [12]. The shape of both formation is nodule, which type appears when the oxide layer is relatively thick (because of slow cooling rate in normal atmosphere).…”
Section: Resultsmentioning
confidence: 99%
“…2 shows one of the experimental results. The whisker-like formation (Sample 4) is compared with an image from the literature [12]. The shape of both formation is nodule, which type appears when the oxide layer is relatively thick (because of slow cooling rate in normal atmosphere).…”
Section: Resultsmentioning
confidence: 99%
“…Dew condensation can cause these devices to short circuit, leading to corrosion or to whisker and dendrite growth. 3) Furthermore, the size of a condensed dew particle that can damage a circuit is now on the order of just the wavelength of visible light. However, detection of these so-called micro-dew particles using a conventional chilled mirror hygrometer is difficult because of the diffraction limit of light.…”
Section: Introductionmentioning
confidence: 99%