Growth of Cu/Zn Alloy Films Sputtered on Flexible Acrylic Resin-Coated PET Substrates

Abstract

Cu/Zn alloy films were DC-sputtered on flexible acrylic resin-coated PET substrates and the effect of sputtering condition on the morphology and growth rate of Cu/Zn alloy films were investigated. It is found that long sputtering time, low voltage and large target-tosubstrate distance can lead to smooth and uniform films. Chamber pressure must be well controlled at several Pascal. High voltage, short target-to-substrate distance and media chamber pressure can improve the growth rate of Cu/Zn alloy films. The suitable DC sputtering condition is 1.6 kV of voltage, 25 mm of target-to-substrate distance, 10 Pa of chamber pressure and 20 min of sputtering time, under which the as-prepared Cu/Zn alloy films possess of smooth surface and 41 nm of thickness.