Growth mechanism of TiN reaction layers produced on AlN via active metal bonding

Terasaki, Nobuyuki; Sakaguchi, Masumi; Chiba, Harumi; Ohashi, Touyou; Nagatomo, Yoshiyuki; Kuromitsu, Yoshirou; Sekino, Tohru; Knowles, Kevin M.

doi:10.1007/s10853-022-07472-6

Cited by 5 publications

(1 citation statement)

References 27 publications

(22 reference statements)

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“…Currently, various joining techniques are being applied to achieve the reliable joining of ceramics to themselves or metals (alloys) [11]. Brazing, with good repeatability and relatively small thermal effect, is the main method used in the field of dissimilar material bonding [12][13][14]. However, the different types of chemical bonds cause problems such as poor wettability and poor metallurgical bonding.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Microstructure and Mechanical Properties of Titanium/Sapphire Joints Brazed with AuSn20 Filler Metal

et al. 2022

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In this study, C-plane (0001) sapphire was successfully brazed to titanium using AuSn20 filler metal, following metallization on the surface of the sapphire with Sn-3Ti (wt.%). At 1000 °C, Sn-3Ti had good wettability on the surface of the sapphire, with the lowest equilibrium contact angle of 57°. The reaction phases in the joints were identified, and the typical interfacial microstructure of the brazed joint brazed at 550 °C for 30 min was titanium substrate/Au-Sn-Ti layer/Ti6Sn5 + AuSn2 + AuSn4 + massive Au-Sn-Ti/TiO phase/sapphire. The shear test was utilized to evaluate the bonding strength of the titanium/sapphire joints. The highest shear strength reached 18.7 MPa when brazed at 550 °C for 35 min. The crack was initiated at the sapphire/brazing seam interface and propagated into the Au-Sn-Ti reaction layer.

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Section: Introductionmentioning

confidence: 99%

Interfacial Microstructure and Mechanical Properties of Titanium/Sapphire Joints Brazed with AuSn20 Filler Metal

et al. 2022

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Interfacial structure between TiN sintered ceramics with and without an Fe-containing grain boundary phase and Ag–Cu eutectic brazing filler material

et al. 2022

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To focus on the interfacial reaction between the Ag–Cu alloy layer and TiN in active metal brazing, the Ag–Cu brazed interfacial structures between Cu and two types of TiN sintered ceramics fabricated by different methods were examined. No grain boundary phase components consisting of the Ni-containing Fe phase or Mo2C were detected on the TiN grain surfaces of the TiN liquid-phase sintered ceramic bonding surfaces before brazing. The brazed specimens were heated at 850 °C for 0.5 h. No Cu/TiN solid-phase sintered ceramic bonding was obtained. The Ag–Cu alloy layer was bonded onto the TiN grains in the TiN liquid-phase sintered ceramic through an Fe- and Ni-containing segregation layer. This segregation layer was formed by an interfacial reaction between the TiN grains and the Ni-containing Fe in the TiN liquid-phase sintered ceramic dissolved in the Ag–Cu liquid phase.

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Effect of interfacial structure on peel strength between Cu and AlN bonded with a Mg–Ti co-deposited film

et al. 2023

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Eliminating electrochemical migration of Ag is effective for improving the long-term reliability of power modules for high-voltage applications. In this work, a Cu plate was bonded onto an AlN substrate via Mg–Ti co-deposited films with three different compositions as Ag-free bonding materials between 800 and 950 °C for 0.5 h. The interfacial structures and the peel strength between the Cu and AlN were investigated by using the Surface And Interfacial Cutting Analysis System (SAICAS). Cu was bonded onto AlN through a TiN layer consisting of TiN particles and a Cu-containing grain boundary phase. All fractures at the Cu/AlN interface were observed to occur between the TiN layer and AlN after the SAICAS test. The peel strength at the Cu/AlN interface, which was independent of the thickness of the TiN layer, increased exponentially with increasing bonding temperature. Cu-containing phases, such as grain boundary phases and segregation phases between TiN particles and AlN, were present at the TiN layer/AlN interface. Mg and O were segregated at the interface, which had a high peel strength between the Cu-containing phase and AlN, while at the signal peak position of Mg, a plateau was observed in the Al concentration distribution between the Cu-containing phase and TiN particle. The peel strength of the Cu-containing phase/AlN interface, which increased as the O concentration in the Mg-containing segregation layer increased, dominated that of the TiN layer/AlN interface.

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Growth mechanism of TiN reaction layers produced on AlN via active metal bonding

Cited by 5 publications

References 27 publications

Interfacial Microstructure and Mechanical Properties of Titanium/Sapphire Joints Brazed with AuSn20 Filler Metal

Interfacial Microstructure and Mechanical Properties of Titanium/Sapphire Joints Brazed with AuSn20 Filler Metal

Interfacial structure between TiN sintered ceramics with and without an Fe-containing grain boundary phase and Ag–Cu eutectic brazing filler material

Effect of interfacial structure on peel strength between Cu and AlN bonded with a Mg–Ti co-deposited film

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