Growth Mechanism during the Early Stages of electrodeposition of Bismuth telluride films

Zimmer, Alexandre; Broch, Laurent; Boulanger, Clotilde; Stein, Nicolas

doi:10.1016/j.electacta.2015.05.190

Cited by 23 publications

(9 citation statements)

References 37 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

Section: Potential Distribution Within Slm-ti Scaffoldssupporting

confidence: 80%

“…The CV diagrams of both dense and porous SLM-Ti samples show a characteristic hysteresis which appeared after potential sweep reversal. Based on the previous potentiostatic experiments [22,23], it can be confirmed that under the present experimental conditions, the electrodeposition on titanium substrate occurred predominantly in a 3D nucleation mode. To analyze the local deposition process, the micro-reference electrode was placed at different depths of SLM-Ti scaffolds for CV experiments under the same setting from −1.8 to 0.2 V. When the micro-reference electrode was placed on the bottom surface of the SLM-Ti scaffolds, the actual applied potential was the largest to make up for the ohmic drop.…”

Section: Nucleation and Growth Of Cap Coatingssupporting

confidence: 80%

See 1 more Smart Citation

Electrochemical Studies on CaP Electrodeposition on Three Dimensional Surfaces of Selective Laser Melted Titanium Scaffold

Sun

Lin²,

Zhang³

et al. 2019

Coatings

View full text Add to dashboard Cite

In this work, calcium phosphate (CaP) coating was electrodeposited on the three dimensional surface of SLM-Ti scaffolds. The in situ measurement showed that the potential variation within 5 mm thickness porous selective laser melting (SLM)-Ti samples was about 80 mV as a result of the low conductivity of CaP coatings. SEM observation results revealed that the coating morphology depended on the distance between the surface position of porous SLM-Ti electrode and the auxiliary electrode. Based on the compared electrochemical experiments, it was found that the top and the bottom surfaces of SLM-Ti scaffolds exhibited continuous nucleation and instantaneous nucleation behavior respectively. The Electrochemical impedance spectroscopy (EIS) results also revealed that the electrodeposition processes at different depth of SLM-Ti scaffolds were not synchronized. These differences were ultimately caused by the non-uniform distribution of the potential and the current inside porous SLM-Ti electrodes. The present work provides a basic research method for studying the mechanism of the electrochemical process on three dimensional surfaces of SLM-Ti scaffolds.

show abstract

Section: Potential Distribution Within Slm-ti Scaffoldssupporting

confidence: 80%

Section: Nucleation and Growth Of Cap Coatingssupporting

confidence: 80%

Electrochemical Studies on CaP Electrodeposition on Three Dimensional Surfaces of Selective Laser Melted Titanium Scaffold

Sun

Lin²,

Zhang³

et al. 2019

Coatings

View full text Add to dashboard Cite

show abstract

“…The initial sharp drop of the current density corresponds to the charging of the electric double layer [21] . The later increase corresponds to the three‐dimensional (3D) growth of the nuclei, which involves a larger active surface area [22] . The decrease of the current density after the maximum value reflects that the deposition is controlled by the linear diffusion of the cationic precursor to the electrode [22] .…”

Section: Resultsmentioning

confidence: 99%

“…The later increase corresponds to the three‐dimensional (3D) growth of the nuclei, which involves a larger active surface area [22] . The decrease of the current density after the maximum value reflects that the deposition is controlled by the linear diffusion of the cationic precursor to the electrode [22] . With a more negative initial potential (

E

=−0.35 V), a larger peak current density I m can be obtained at a shorter period of time t m , because larger overpotentials can promote the nucleation process of Cu [23] .…”

Section: Resultsmentioning

confidence: 99%

Size Refinement of Copper Nanoparticles: A Perspective from Electrochemical Nucleation and Growth Mechanism

et al. 2021

View full text Add to dashboard Cite

In this paper, isotropic copper nanoparticles (CuNPs) were successfully sythesized by using Cu(CH3COO)2 and ascorbic acid in absolute ethanol solution. With the addition of polyvinylpyrrolidone (PVP) protective additive, the size distribution range of the synthesized CuNPs was significantly reduced from 650±415 nm to 51±12 nm. Electrodeposition analysis revealed that PVP could greatly suppress the reduction of Cu but had no prominent effects on the deposition mechanism. Based on the potentiostatic deposition results, a growth model was proposed to improve the applicability of the Scharifker‐Hills model by considering both the surface inhibition effect and the mass diffusion during the growth process of Cu nuclei. The experimental data fitted well with the prediction results from the proposed model, indicating that the electrodeposition of Cu followed the progressive nucleation process. The PVP additive could inhibit the deposition and growth of Cu by increasing the surface inhibition for cation incorporation on the nuclei, which was probably the main reason for the refinement of the sythesized CuNPs. Our findings can provide insights for the preparation of metallic nanoparticles and the understanding of their deposition mechanism.

show abstract

“…Recently, metal matrix composites reinforced with solid particles have been widely applied in many engineering fields owing to their enhanced physical and chemical properties (e.g., high level of hardness, wear and corrosion resistance, and thermal stability, among others) [1][2][3]. Generally, metallic composites can be fabricated through diverse technologies, such as hot pressing [4], casting [5], thermal spraying [6], cold spraying [7], powder metallurgy [8], and electrochemical deposition [9]. Among these techniques, electrodeposition has attracted much attention due to its lower cost and ability to operate at an ambient temperature and under normal pressure.…”

Section: Introductionmentioning

confidence: 99%

Electrodeposition Kinetics of Ni/Nano-Y2O3 Composite Coatings

Zhou

Wang

Liu

et al. 2018

Metals

View full text Add to dashboard Cite

Ni/nano-Y2O3 composite films were successfully prepared by electrochemical deposition using an acid sulfamate bath. The influence of solid particles added to electrolyte on electrodeposition was investigated by electrochemical measurement methods. The linear sweep voltammetry test showed that the composite deposition took place at a greater potential than that of nickel, and the presence of nano-Y2O3 decreased cathodic polarization. Chronoamperometry studies indicated that the nucleation model of both deposits similarly approached the theoretical instantaneous nucleation mode based on the Scharifker–Hills model. The Y2O3 particles adsorbed on the cathodic surface were shown to facilitate the nucleation/growth of the nickel matrix which is consistent with the deposition kinetics parameters calculated by non-linear fitting experimental curves. The results of electrochemical impedance spectroscopy showed that the presence of Y2O3 particles in a bath is beneficial for the decrease in charge transfer resistance in the deposition. The atomic force microscopy observations of both deposits obtained in the initial electrodeposition stage confirmed that the Ni-Y2O3 composite had a higher grain number and finer mean grain size.

show abstract

Growth Mechanism during the Early Stages of electrodeposition of Bismuth telluride films

Cited by 23 publications

References 37 publications

Electrochemical Studies on CaP Electrodeposition on Three Dimensional Surfaces of Selective Laser Melted Titanium Scaffold

Electrochemical Studies on CaP Electrodeposition on Three Dimensional Surfaces of Selective Laser Melted Titanium Scaffold

Size Refinement of Copper Nanoparticles: A Perspective from Electrochemical Nucleation and Growth Mechanism

Electrodeposition Kinetics of Ni/Nano-Y2O3 Composite Coatings

Contact Info

Product

Resources

About