2022
DOI: 10.3390/nano12081340
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Growth, Electronic and Electrical Characterization of Ge-Rich Ge–Sb–Te Alloy

Abstract: In this study, we deposit a Ge-rich Ge–Sb–Te alloy by physical vapor deposition (PVD) in the amorphous phase on silicon substrates. We study in-situ, by X-ray and ultraviolet photoemission spectroscopies (XPS and UPS), the electronic properties and carefully ascertain the alloy composition to be GST 29 20 28. Subsequently, Raman spectroscopy is employed to corroborate the results from the photoemission study. X-ray diffraction is used upon annealing to study the crystallization of such an alloy and identify th… Show more

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Cited by 6 publications
(6 citation statements)
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“…[ 30 ] The cycle numbers of TiTe 2 ‐PCH, NiTe 2 ‐PCH, and MoTe 2 ‐PCH were ≈2×10 6 , ≈4×10 5 , and ≈1×10 7 , respectively. Compared with devices using conventional bulk PCM layers, [ 31,32 ] the TiTe 2 ‐PCH and MoTe 2 ‐PCH devices exhibited significantly improved cycling endurance. Interestingly, RESET failures were observed for (Ti, Mo)Te 2 ‐PCH (Figures 1d,f), attributable to the mechanical stress at the interface between the PCM and bottom electrode contact (heater), [ 33 ] whereas NiTe 2 ‐PCH exhibited SET failures (Figure 1e), likely originating from incongruent melting and elemental segregation.…”
Section: Resultsmentioning
confidence: 99%
“…[ 30 ] The cycle numbers of TiTe 2 ‐PCH, NiTe 2 ‐PCH, and MoTe 2 ‐PCH were ≈2×10 6 , ≈4×10 5 , and ≈1×10 7 , respectively. Compared with devices using conventional bulk PCM layers, [ 31,32 ] the TiTe 2 ‐PCH and MoTe 2 ‐PCH devices exhibited significantly improved cycling endurance. Interestingly, RESET failures were observed for (Ti, Mo)Te 2 ‐PCH (Figures 1d,f), attributable to the mechanical stress at the interface between the PCM and bottom electrode contact (heater), [ 33 ] whereas NiTe 2 ‐PCH exhibited SET failures (Figure 1e), likely originating from incongruent melting and elemental segregation.…”
Section: Resultsmentioning
confidence: 99%
“…Zuliani et al explored the region rich in Ge element in the GST ternary diagram, which made the thermal stability of Ge-rich GST meet the specifications of automobile application, but the programming speed loss was about one-third of GST [ 6 ]. Diaz et al improved the bottom electrode contact and thermal stability (1h retention is 230 °C) by adding a GST buffer layer under Ge-rich GST [ 7 ]. The high thermal stability of a Ge-rich GST alloy is due to the formation of local tetrahedral Ge-Ge bonds, which leads to a more disordered structure; that is, it is less prone to crystallization, which increases the resistivity of crystalline GST and reduces the RESET power consumption of PCRAM [ 6 ].…”
Section: Introductionmentioning
confidence: 99%
“…In previous works, we have studied the synthesis and the crystallization of single Ge-Sb-Te films with variable Ge content [16], as well as heterostructures formed by planar layers of the Ge-Sb-Te system [17]. Moreover, the self-assembly and structural characterization of core-shell nanowires of the Ge-Sb-Te system was investigated [18].…”
Section: Introductionmentioning
confidence: 99%