1998
DOI: 10.1016/s0257-8972(97)00635-x
|View full text |Cite
|
Sign up to set email alerts
|

Growth characteristics of tungsten-carbon films deposited by magnetron sputtering

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

0
2
0

Year Published

2004
2004
2011
2011

Publication Types

Select...
4
1

Relationship

0
5

Authors

Journals

citations
Cited by 5 publications
(2 citation statements)
references
References 8 publications
0
2
0
Order By: Relevance
“…Normally, the incorporated metal is Ti, Cr or W, all of which exhibit a strong bond with the carbon matrix 10–14. However, some other metals (Al, Cu and Ag) exhibit a weak bond with the carbon matrix that are called weak‐carbide‐forming (WCF) metals 15–18.…”
Section: Introductionmentioning
confidence: 99%
“…Normally, the incorporated metal is Ti, Cr or W, all of which exhibit a strong bond with the carbon matrix 10–14. However, some other metals (Al, Cu and Ag) exhibit a weak bond with the carbon matrix that are called weak‐carbide‐forming (WCF) metals 15–18.…”
Section: Introductionmentioning
confidence: 99%
“…Carbon and tungsten sputtering by noble gases ion bombardment has received considerable attention in recent studies of plasma-wall interaction [1][2][3], thin film deposition [4] and other surface science applications [5]. Many studies have shown that the physical properties of deposited carbon and tungsten film strongly depend on the sputtering parameters, like: gas pressure, energy and nature of sputtering gasses [6], target density [7], substrate temperature, target bias voltage, target to substrate distances and deposition angle [8].…”
Section: Introductionmentioning
confidence: 99%