2015
DOI: 10.1088/1742-6596/652/1/012034
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Growing aluminum nitride films by Plasma-Enhanced Atomic Layer Deposition at low temperatures

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Cited by 6 publications
(5 citation statements)
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“…Amorphous AlN is consistent with the reduced band gap value (4.7 eV) of AlN as modeled from SE measurement. ALD AlN thin films grown at 250–300 °C have previously been reported to vary from amorphous to crystalline wurtzite phase. , TiN films grow crystalline and highly oriented cubic phase with a clear (200) peak at 42.8° but without indication of (111) planes parallel to the substrate, despite both (111) and (200) preferred orientations previously reported for TiN films prepared by various methods including thermal ALD, , reactive evaporation, cathodic arc plasma deposition, and magnetron reactive sputtering. The dominant orientations of TiN films depend on several factors including the deposition condition, Ti–N stoichiometry, and film thickness . Surprisingly, we observe that even a small fraction of Al substitution dramatically alters the preferred orientation of TiN films.…”
Section: Resultsmentioning
confidence: 98%
See 1 more Smart Citation
“…Amorphous AlN is consistent with the reduced band gap value (4.7 eV) of AlN as modeled from SE measurement. ALD AlN thin films grown at 250–300 °C have previously been reported to vary from amorphous to crystalline wurtzite phase. , TiN films grow crystalline and highly oriented cubic phase with a clear (200) peak at 42.8° but without indication of (111) planes parallel to the substrate, despite both (111) and (200) preferred orientations previously reported for TiN films prepared by various methods including thermal ALD, , reactive evaporation, cathodic arc plasma deposition, and magnetron reactive sputtering. The dominant orientations of TiN films depend on several factors including the deposition condition, Ti–N stoichiometry, and film thickness . Surprisingly, we observe that even a small fraction of Al substitution dramatically alters the preferred orientation of TiN films.…”
Section: Resultsmentioning
confidence: 98%
“…The measured growth rates are in the range of those previously reported for TiN (0.22−0.8 Å/cycle) and AlN films (0.8−1.0 Å/cycle) grown by PEALD. [11][12][13]29,30 The fitted thickness increase was continuously monitored via in situ SE at a frequency of ∼0.4 Hz, Figure 1. Approximately, 14 cycles of TiN are required before the full growth rate was achieved on the native Si oxide surface under our standard growth conditions.…”
Section: ■ Results and Discussionmentioning
confidence: 99%
“…Besides this classic set of precursors, other precursors and combinations have been introduced. Alternative nitrogen precursors are forming gas (N 2 + H 2 ), , hydrazine (N 2 H 4 ), hydrazinium chloride (N 2 H 5 Cl), and monomethyl hydrazine (N 2 CH 6 ) . Alternative metal precursors are AlCl 3 , , TEA, , TMAA, , TDMAA, , DMEAA, TDEAA, TiBA, and DMAA .…”
Section: Introductionmentioning
confidence: 99%
“…The roughness of AlN films increased with higher deposition temperature and thicker film [31]. Tarala et al obtained crystalline AlN using PEALD at temperatures less than 300 • C [32]. Shih et al used ALD to deposit high-quality single-crystal hexagonal AlN, employing in-situ treatment.…”
Section: Introductionmentioning
confidence: 99%