Grinding Ability of Tungsten-Coated Diamond Composite Sintered Tool.

唯夫, 石川; 智久, 木田; 修, 神谷; 一, 守時

doi:10.1299/kikaia.63.2694

Cited by 7 publications

(3 citation statements)

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“…The bonding strength (800 MPa) between the diamond and matrix core wire is close to the strength of the bronze solder, which was measured in a previous study [ 16 , 24 ]. Although, this strength is sufficient for the cutting tool, the grain distribution is not as uniform as that of industrial products.…”

Section: Resultssupporting

confidence: 76%

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Cutting of Diamond Substrate Using Fixed Diamond Grain Saw Wire

et al. 2022

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This study demonstrates that a single-crystal diamond substrate can be cut along designed lines using the diamond-saw-wire cutting method. We developed an original saw-wire fixed diamond-grain using a bronze solder with a high melting temperature. We created a unique product machine system with a high vacuum furnace and a bronze solder that contains a metallic compound. The diamond cutting mechanism employed in this study is based on the mild wear phenomenon, owing to the friction between the diamond surfaces. A linear relationship between the cutting length and wire feed distance was observed. The relationship can be approximated as y = 0.3622x, where y (µm) is the cutting depth and x (km) is the wire feed distance. The life of the saw-wire was longer than that of the 6000 km wire feed distance and was tested by reciprocating an 8-m short wire at a speed, tension, and cutting force of 150 m/min, 1 N, and 0.2 N, respectively. A single crystal diamond substrate could be cut along the designed line, which was more than 2 mm long. The cutting speed was maintained constant at 0.36 µm/km.

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Section: Resultssupporting

confidence: 76%

“…Ishikawa presented a diamond grain fixed using a metal solder-saw-wire. In this research, the shearing strength of the bronze metal solder was approximately 800 MPa [ 16 ], and the diamond grain was strongly fixed. Therefore, the metal solder-saw-wire could be applied for cutting diamond substrates.…”

Section: Introductionmentioning

confidence: 99%

Cutting of Diamond Substrate Using Fixed Diamond Grain Saw Wire

et al. 2022

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“…In order to develop such a micro wire saw, we used a special solder that contained a metallic compound [1][2][3] . In this paper, we demonstrate that using this solder, diamond grains can be bonded to tungsten wires with a good bonding strength (4) .…”

Section: Introductionmentioning

confidence: 99%