Development of New Micro Saw Wire Bonded with Diamond Grains Using Metal Solder

Kamiya, Osamu; Miyano, Yasuyuki; Takahashi, Mamoru; Kawase, Hiroshi; Sekiguchi, Kazuya; Oga, Yuichi; Suto, Minoru

doi:10.5188/ijsmer.17.182

Cited by 7 publications

(3 citation statements)

References 2 publications

(2 reference statements)

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“…The lateral pressure has a great influence on the finished surface roughness and processing defects such as micro-cracks. In addition, we can find in the experiment process that, under the experimental conditions, when the lateral pressure is higher than 10N, the wire saw bends seriously, surface roughness of workpiece rises sharply and the processing could hardly be conducted normally (Kamiya et al, 2010). Therefore, if an ultrasonic vibration saw is used for cutting, smaller lateral pressure shall be chosen to achieve low surface roughness and good processing quality.…”

Section: Influences Of Lateral Pressure On Surface Roughnessmentioning

confidence: 99%

Research on Key Technologies of Diamond Wire Saw Machining in Hard-brittle Material with Ultrasonic Vibration

2016

Revista de la Facultad de Ingeniería

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In the paper, the new process of rotating electroplated diamond wire saw with ultrasonic vibration is used for cutting and machining the typical hard-brittle materials like glass and zirconia ceramics to analyze its kinematics, dynamics and other basic theories, moreover, the impact rules of wire saw rotating frequency, lateral pressure, abrasive grain and other process parameters on the machining sawing power and surface roughness are researched based on the experiment. The comparison between normal sawing and ultrasonic sawing in glass indicates that: under the same condition, the tangent-saw force of ultrasonic saving is lower than that of normal sawing by 20%~30%, and the normal sawing force is decreased when the lateral pressure of workpiece is small (less than 5N) and increased when the lateral pressure is large (5N or above); when the wire saw rotating frequency is 150rpm, the lateral pressure is 2N and the abrasive grain is 280#, the machining surface will be given with the best quality with surface roughness of Ra=0.3-0.4μm. Therefore, compared to the surface roughness of Ra=0.8-1.0μm of normal sawing under the same condition, the ultrasonic sawing is superior to the normal sawing by 1-2 levels.

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Section: Influences Of Lateral Pressure On Surface Roughnessmentioning

confidence: 99%

Research on Key Technologies of Diamond Wire Saw Machining in Hard-brittle Material with Ultrasonic Vibration

2016

Revista de la Facultad de Ingeniería

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“…Next, we investigated a method of producing a diamond saw-wire-fixed-grain using a metal solder in a vacuum chamber. Additionally, we developed a unique solder that contained a metallic compound [ 19 , 20 , 21 ]. Diamond grains could be bonded to the tungsten wires using this solder, which could be used for cutting extremely tough materials.…”

Section: Introductionmentioning

confidence: 99%

Cutting of Diamond Substrate Using Fixed Diamond Grain Saw Wire

et al. 2022

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This study demonstrates that a single-crystal diamond substrate can be cut along designed lines using the diamond-saw-wire cutting method. We developed an original saw-wire fixed diamond-grain using a bronze solder with a high melting temperature. We created a unique product machine system with a high vacuum furnace and a bronze solder that contains a metallic compound. The diamond cutting mechanism employed in this study is based on the mild wear phenomenon, owing to the friction between the diamond surfaces. A linear relationship between the cutting length and wire feed distance was observed. The relationship can be approximated as y = 0.3622x, where y (µm) is the cutting depth and x (km) is the wire feed distance. The life of the saw-wire was longer than that of the 6000 km wire feed distance and was tested by reciprocating an 8-m short wire at a speed, tension, and cutting force of 150 m/min, 1 N, and 0.2 N, respectively. A single crystal diamond substrate could be cut along the designed line, which was more than 2 mm long. The cutting speed was maintained constant at 0.36 µm/km.

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“…In recent years, multi-wire sawing has emerged as the mainstream slicing method for ingots with large diameter. In addition, new types of wire tools and slicing devices are being developed [2][3][4]. Currently, when several thin layers are sliced from an ingot using a multi-wire saw, the volume of kerf loss is same or more than the volume of the wafers [5].…”

Section: Introductionmentioning

confidence: 99%

Extremely Thin Metal Foil Blades as Cutting Tools for Hard and Brittle Materials

et al. 2018

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The manufacturing costs of semiconductor products such as silicon wafers can be reduced by decreasing the kerf loss. In addition, a decrease in the kerf loss leads to an effective utilization of rare materials, which is environmentally beneficial from the viewpoint of saving resources. This study aims to reduce the kerf loss during slicing hard and brittle materials. Therefore, the possibility of using an extremely thin metal foil blade instead of a wire tool in slicing was examined. Initially, grooving characteristics using a metal foil blade (thickness: 50 μm or less) was investigated. The main conclusions are that grooving with a metal foil blade is possible and kerf loss can be reduced. The groove depth tends to increase as the machining time and particle size of abrasives increase. The groove width is smaller when a thin metal foil blade is used and vice versa. However, if the abrasive particle size is too large, grooving becomes impossible. Since the wear of metal foil blade increases with an increase in the particle size of the abrasive, it is necessary to use an abrasive with a particle size that is suitable for the thickness of the metal foil blade.

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Development of New Micro Saw Wire Bonded with Diamond Grains Using Metal Solder

Cited by 7 publications

References 2 publications

Research on Key Technologies of Diamond Wire Saw Machining in Hard-brittle Material with Ultrasonic Vibration

Research on Key Technologies of Diamond Wire Saw Machining in Hard-brittle Material with Ultrasonic Vibration

Cutting of Diamond Substrate Using Fixed Diamond Grain Saw Wire

Extremely Thin Metal Foil Blades as Cutting Tools for Hard and Brittle Materials

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