2017
DOI: 10.1016/j.ijheatmasstransfer.2016.12.036
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Graphics cards based topography artefacts simulations in Scanning Thermal Microscopy

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Cited by 12 publications
(11 citation statements)
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“…Synthetic data were used to create simple structures that could be compared to experimental data, as shown in the figure, and were an important step in validation of the method and moving towards simulations of more realistic structures. A,B) topography and thermal signal on a step height structure, (C) experimental data and result of the FDM calculation using simulated step height structure [36], simulating a single profile. Simulated signal is scaled to match the raw SThM signal coming from the probe and the Wheatstone bridge.…”
Section: Non-topographical Spm Quantitiesmentioning
confidence: 99%
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“…Synthetic data were used to create simple structures that could be compared to experimental data, as shown in the figure, and were an important step in validation of the method and moving towards simulations of more realistic structures. A,B) topography and thermal signal on a step height structure, (C) experimental data and result of the FDM calculation using simulated step height structure [36], simulating a single profile. Simulated signal is scaled to match the raw SThM signal coming from the probe and the Wheatstone bridge.…”
Section: Non-topographical Spm Quantitiesmentioning
confidence: 99%
“…Additionally, in scanning thermal microscopy (SThM), the topography artefacts can dominate the signal and methods for their simulation are needed [ 36 ]. In Figure 11 , the typical behaviour of the thermal signal on a step edge is shown, together with the result of a finite difference model (FDM) solving the Poisson equation.…”
Section: Synthetic Data Applicationsmentioning
confidence: 99%
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“…As computing power increased drastically, it is now possible to create complex FE models including sophisticated geometries assigning various materials to different regions. For example, the full probe-sample system can be modelled, for example, to study radiation thermal transport [93], immersion SThM and probe sensitivity in various environments [50,88], time-constant of the probe and tip-sample resistance [65] or even topography-related arterfacts [97]. Thus FE modelling is becoming a necessary tool for investigating tip-sample systems complementary to analytical analysis as it handles difficult geometries and multiphysical problems.…”
Section: Finite Element Analysis Compared To Analytical Formulationsmentioning
confidence: 99%