Two-dimensional
materials (2DMs) have attracted a great
deal of
interest due to their immense potential for scientific breakthroughs
and technological innovations. While some 2D transition metal dichalcogenides
(TMDC) such as MoS2 and WS2 are considered as
the ultimate channel materials in unltrascaled transistors as replacements
for Si, there has also been increasing interest in the monolithic
3D integration of 2DMs on the Si CMOS platform or in flexible electronics
as back-end-of-line transistors, memory devices/selectors, and sensors,
taking advantage of 2DM properties such as a high current driving
capability with low leakage current, nonvolatile switching characteristics,
a large surface-to-volume ratio, and a tunable bandgap. However, the
realization of both of these scenarios critically depends on the development
of manufacturing-viable high-yield 2DM layers transfer from the growth
substrate to the Si, since the growth of high-quality 2DM layers often
requires a high-temperature growth process on template substrates.
Motivated by this, extensive efforts have been made by the 2DM research
community to develop various 2DM layer transfer methods, leveraging
the van der Waals transfer capability of the layer-structured 2DMs.
These efforts have led to a number of successful demonstrations of
wafer-scale 2D TMDC layer transfer, while 2DM-enabled template growth/transfer
of some functional bulk materials such as III–V, Ge, and AlN
has also been demonstrated. This review surveys and compares different
2DM transfer methods developed recently, with a focus on large-area
2D TMDC film transfer along with an introduction of 2DM template-assisted
van der Waals growth/transfer of non-2D thin films. We will also briefly
present an outlook of our envisioned multifunctionalities in 3D integrated
electronic systems enabled by monolithic 3D integration of 2DMs and
III–V via van der Waals transfer and discuss possible technology
options for overcoming remaining challenges.