2019
DOI: 10.1016/j.matchemphys.2018.12.026
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Graphene/Cu composites: Electronic and mechanical properties by first-principles calculation

Abstract: Cu composite materials was systematically summarized. • Graphene/Cu systems present an excellent electrical conductivity and increasing Debye temperature compared with pure Cu. • Compared to copper, the tensile strength of graphene/Cu composites are enhanced by 174% and 162% in parallel to the direction of graphene. • Strengthening and toughening effects of graphene in composites is originated from strain strengthening and load transfer.

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Cited by 21 publications
(10 citation statements)
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“…To simplify the calculation, we chose the Fe-O 3 -Fe-R as a typical model for α-Fe 2 O 3 . As shown in Figure 6 a,b, the distance between the nearest Fe atom to the interface and B or N were 2.125 or 2.357Å, respectively, closely negative to their interface bonding performance [ 50 ]. The structures of Gr fluctuated greatly due to introducing O, P, and S, as shown in Figure 6 c–e.…”
Section: Resultsmentioning
confidence: 99%
“…To simplify the calculation, we chose the Fe-O 3 -Fe-R as a typical model for α-Fe 2 O 3 . As shown in Figure 6 a,b, the distance between the nearest Fe atom to the interface and B or N were 2.125 or 2.357Å, respectively, closely negative to their interface bonding performance [ 50 ]. The structures of Gr fluctuated greatly due to introducing O, P, and S, as shown in Figure 6 c–e.…”
Section: Resultsmentioning
confidence: 99%
“…Next, the AA stacked bilayer graphene model is formed by supercell with a layer spacing of 0.34 nm [ 26 ]. Regarding the way of introducing graphene for traditional metallic materials, considering that the composite of two substances is involved, heterojunction structure is used for construction in this paper [ 27 ]. Lattice mismatch degree is an important parameter for heterojunction structure.…”
Section: Computational Methodologymentioning
confidence: 99%
“…Copper has high TC (401.00 W mK À1 ) and EC (5.96 Â 10 7 S m À1 ), good corrosion resistance properties, and an environmentally friendly nature. [11] Therefore, it is widely used in integrated circuits, electrical conductors, radiators, etc. [11,12] In contrast, electromigration, low scalability, high resistivity, poor mechanical properties, and other performance hindrances restrict the application of copper-based interconnect.…”
Section: Introductionmentioning
confidence: 99%
“…[11] Therefore, it is widely used in integrated circuits, electrical conductors, radiators, etc. [11,12] In contrast, electromigration, low scalability, high resistivity, poor mechanical properties, and other performance hindrances restrict the application of copper-based interconnect. [13] Graphene-reinforced metal composites show superior performance to pristine metal in terms of mechanical strength, EC and TC, and weight.…”
Section: Introductionmentioning
confidence: 99%