2017
DOI: 10.3390/ma10080919
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Grain Refinement and Mechanical Properties of Cu–Cr–Zr Alloys with Different Nano-Sized TiCp Addition

Abstract: The TiCp/Cu master alloy was prepared via thermal explosion reaction. Afterwards, the nano-sized TiCp/Cu master alloy was dispersed by electromagnetic stirring casting into the melting Cu–Cr–Zr alloys to fabricate the nano-sized TiCp-reinforced Cu–Cr–Zr composites. Results show that nano-sized TiCp can effectively refine the grain size of Cu–Cr–Zr alloys. The morphologies of grain in Cu–Cr–Zr composites changed from dendritic grain to equiaxed crystal because of the addition and dispersion of nano-sized TiCp. … Show more

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Cited by 11 publications
(6 citation statements)
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“…These phases were reported due to the low interfacial energy, but the low presence is related to the reaction with other components to form other intermetallics. The formation of Cu 3 Ti is linked to reduction of interfacial energy greater than provided for CuTi, CuTi 2 , Cu 4 Ti 3 in the reactions between Cu-Ti and first intermetallics of the sintering process, in combination with TiC particles that modified the nucleation of complex phases as reported by Zhang et al [41].…”
Section: Microstructure Of the Compositesmentioning
confidence: 70%
“…These phases were reported due to the low interfacial energy, but the low presence is related to the reaction with other components to form other intermetallics. The formation of Cu 3 Ti is linked to reduction of interfacial energy greater than provided for CuTi, CuTi 2 , Cu 4 Ti 3 in the reactions between Cu-Ti and first intermetallics of the sintering process, in combination with TiC particles that modified the nucleation of complex phases as reported by Zhang et al [41].…”
Section: Microstructure Of the Compositesmentioning
confidence: 70%
“…Copper and its alloys are widely used in automobile, electronic, and electric power industries due to their high strength, high thermal and electrical conductivity, and good ductility, as well as because they can be easily shaped [1][2][3][4][5][6]. To satisfy applications in the frame materials in large-scale integrity circuits, besides the requirement of high strength and high electrical conductivity, excellent recrystallization resistance is also needed.…”
Section: Introductionmentioning
confidence: 99%
“…Compacted reinforced TiC-TiB 2 /Cu cermets composites with homogeneous dispersion have been obtained. Zhang et al [ 34 ] revealed that the trace elements Cr and Zr are the best strengthening elements of Cu alloys. In this study, a hot pressing-sintering in-situ reaction is used to prevent formation of voids in cermets [ 35 , 36 ].…”
Section: Introductionmentioning
confidence: 99%