Grain-growth kinetics of nanostructured gold

Yevtushenko, Oleksandra; Natter, Harald; Hempelmann, Rolf

doi:10.1016/j.tsf.2005.12.098

Cited by 25 publications

(15 citation statements)

References 17 publications

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“…41 Similar results were also reported for cryomilled nc-Ti, 9 cold-rolled Ti-24Nb-4Zr-7.9Sn alloy, 12 severely deformed Mg-Al alloys, 41 and electrodeposited nanocrystalline gold. 42 It is expected that the nonequilibrium grain boundaries in the SMATed Zr increase atomic mobility and result in the abnormal low Q value. This suggests that the grain growth in the present nanograined Zr is dominated by grain boundary diffusion, similar to what is observed in nanograined Cu.…”

Section: A Thermal Stabilitymentioning

confidence: 99%

Thermal stability and corrosion resistance of nanocrystallized zirconium formed by surface mechanical attrition treatment

Han

Zhang

et al. 2009

J. Mater. Res.

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The thermal stability and corrosion behavior of the nanostructured layer on commercially pure zirconium, produced by surface mechanical attrition treatment (SMAT), were investigated. It is indicated that the nanograined Zr is stable at annealing temperatures up to 650 °C, above which significant grain growth occurs and the grain size shows parabolic relationship with annealing time. The activation energy for grain growth of the nanograined Zr is 59 kJ/mol at 750–850 °C, and the grain growth is dominated by grain-boundary diffusion. The as-SMATed nanograined Zr exhibits higher corrosion resistance than the 550–750 °C annealed SMATed Zr and the unSMATed coarse-grained Zr. It is indicated that the corrosion resistance of Zr tends to increase with the reduction of grain size, which is related to the dilution of segregated impurities at grain boundaries due to grain refinement and the formation of passive protection film.

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Section: A Thermal Stabilitymentioning

confidence: 99%

Thermal stability and corrosion resistance of nanocrystallized zirconium formed by surface mechanical attrition treatment

Han

Zhang

et al. 2009

J. Mater. Res.

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“…Recently, preparation and characterization of nanocrystalline (nc) metal film materials have been the subject of intensive researches [1][2][3][4][5]. Various techniques of preparing nc metal film materials, such as electrodeposition [5,6], direct current (DC) magnetron sputtering [7][8][9], physical vapor deposition [10], chemical vapor deposition [11], laser beam deposition [12], ion implantation [13], plasma and high-velocity oxygen fuel spraying [13] have been developed.…”

Section: Introductionmentioning

confidence: 99%

Preparation of Nanocrystalline Cu Films by Brush-Plating

Zhao

Sun

et al. 2012

Integrated Ferroelectrics

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Nanocrystalline Cu films were prepared by electric brush-plating. Microstructure characterization by X-diffraction analysis and transmission electron microscope reveals that the average grain size of the nanocrystalline Cu films increases from 24.4 to 150.5 nm with decreases in current density and concentration of Cu ions in bath. A number of growth twins are observed at lower current density and concentration of Cu ions. The results reveal that the nanocrystalline Cu films with wider ranges of grain size and/or high content of growth twins can be prepared by brush-plating technique with suitable controls of current density and concentration of Cu ions in bath.

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“…In summary, the AFM micrographs and XRD patterns indicate that smooth and defect-free gold film with ultrafine grain size of 10.5 nm can be achieved by the optimized parameters of the PCE. The grain size is smaller than the values reported in previous studies [15][16][17]. For the optimized PCE parameters, the pulse current is 10 mA/cm 2 and the off-time current is 0 mA/cm 2 .…”

Section: Pulse-current Electrodeposition Of Ultrafine Nanocrystallinementioning

confidence: 56%

Pulse-Current Electrodeposition of Gold

Chen¹,

Yoshiba²,

Tang³

et al. 2019

Novel Metal Electrodeposition and the Recent Application

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Pulse-current electrodeposition and a sulfite-based electrolyte were used in fabrication of pure gold films. Surface of the pulse-electrodeposited gold film possessed less defect, lower roughness, smaller grain size, and denser texture when compared with the gold film prepared by constant-current electrodeposition. Microstructures and compressive yield strength of the electrodeposited gold could be controlled by regulating the pulse on-time and off-time intervals in pulse-current electrodeposition. The gold film prepared under the optimum conditions showed an average grain size at 10.4 nm, and the compressive yield strength reached 800 MPa for a pillar-type micro-specimen having dimensions of 10 μm × 10 μm × 20 μm fabricated from the pulse-electrodeposited gold film. Average grain size of the pulse-electrodeposited gold film was much smaller, and the compressive yield strength was much higher than the values reported in other studies. The high strength is due to the grain boundary strengthening mechanism known as the Hall-Petch relationship. In general, the pulse-electrodeposited gold films showed yield strength ranging from 400 to 673 MPa when the average grain size varied by adjusting the pulse-electrodeposition parameters.

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Grain-growth kinetics of nanostructured gold

Cited by 25 publications

References 17 publications

Thermal stability and corrosion resistance of nanocrystallized zirconium formed by surface mechanical attrition treatment

Thermal stability and corrosion resistance of nanocrystallized zirconium formed by surface mechanical attrition treatment

Preparation of Nanocrystalline Cu Films by Brush-Plating

Pulse-Current Electrodeposition of Gold

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