Preparation of Nanocrystalline Cu Films by Brush-Plating

Abstract

Nanocrystalline Cu films were prepared by electric brush-plating. Microstructure characterization by X-diffraction analysis and transmission electron microscope reveals that the average grain size of the nanocrystalline Cu films increases from 24.4 to 150.5 nm with decreases in current density and concentration of Cu ions in bath. A number of growth twins are observed at lower current density and concentration of Cu ions. The results reveal that the nanocrystalline Cu films with wider ranges of grain size and/or high content of growth twins can be prepared by brush-plating technique with suitable controls of current density and concentration of Cu ions in bath.

Dislocation-mediated creep process in nanocrystalline Cu

“…As shown in Fig. 7, more growth twinning could be found in the NC Cu with larger grain size, which is consistent with our recent research [19] on the same NC Cu. The above deformation activities that occurred in loading and holding regimes may result in some local motion of GBs and hence trigger possible grain growth [28] or refinement [29] in the regions near the indenter, which would affect the deformation behavior discussed in the following.…”

“…The brush-plating operation was carried out at room temperature on a brush-plating system developed recently. [5,19] In order to obtain NC Cu with different average grain sizes, different current densities, and concentration of CuSO 4 in the bath (1338.6 mA/cm 2 , 300 g/l; 690.3 mA/cm 2 , 300 g/l; 251.8 mA/cm 2 , 300 g/l; 251.8 mA/cm 2 , 200 g/l; 251.8 mA/cm 2 , 100 g/l) were used. The purity and density of these NC Cu were ∼ 99.7 wt.% and ∼ 8.95 g/cm 3 , respectively.…”

Microstructural Modification of Brush-Plated Nanocrystalline Cr by High Current Pulsed Electron Beam Irradiation

“…Wu et al [4] synthesized Nanocrystalline Cr by electrodeposition and examined microstructures. Mu et al [6] prepared Nanocrystalline Cu films by electric brush-plating and presented their microstructure characterization. Wang et al [7] and Hu et al [8] conducted creep tests on a nanocrystalline Cu at room temperature.…”