Grain boundary segregation-induced strengthening-weakening transition and its ideal maximum strength in nanopolycrystalline FeNiCrCoCu high-entropy alloys

He, Tengwu; Qi, Yuming; Ji, Yanzhou; Feng, Miaolin

doi:10.1016/j.ijmecsci.2022.107828

Cited by 23 publications

(7 citation statements)

References 62 publications

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“…The authors reported that Cr has a strong self-bonding tendency leading to improved GB strength. Moreover, the strengthening effect of Cu atoms at the GBs of CoCrCuFeNi HEA was observed earlier in [52] using combined MD/Monte Carlo modelling. Similarly, we observed higher stress required for the plastic shear deformation of bicrystals with Cr and Cu at GBs compared with other cases.…”

Section: Discussionsupporting

confidence: 55%

Effect of Segregation on Deformation Behaviour of Nanoscale CoCrCuFeNi High-Entropy Alloy

Kazakov¹,

Yakhin²,

Karimov

et al. 2023

Applied Sciences

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A molecular dynamics (MD) simulation method is used to investigate the effect of grain boundary (GB) segregation on the deformation behavior of bicrystals of equiatomic nanoscale CoCrCuFeNi high-entropy alloy (HEA). The deformation mechanisms during shear and tensile deformation at 300 K and 100 K are analyzed. It is revealed that upon tensile deformation, the stacking fault formation, and twinning are the main deformation mechanisms, while for the shear deformation, the main contribution to the plastic flow is realized through the GB migration. The presence of the segregation at GBs leads to the stabilization of GBs, while during the shear deformation of the nanoscale CoCrCuFeNi HEA without the segregation at GBs, GBs are subject to migration. It is found that the GB segregation can differently influence the plasticity of the nanoscale CoCrCuFeNi HEA, depending on the elemental composition of the segregation layer. In the case of copper and nickel segregations, an increase in the segregation layer size enhances the plasticity of the nanoscale CoCrCuFeNi HEA. However, an increase in the thickness of chromium segregations deteriorates the plasticity while enhancing maximum shear stress. The results obtained in this study shed light on the development of HEAs with enhanced mechanical properties via GB engineering.

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Section: Discussionsupporting

confidence: 55%

Effect of Segregation on Deformation Behaviour of Nanoscale CoCrCuFeNi High-Entropy Alloy

Kazakov¹,

Yakhin²,

Karimov

et al. 2023

Applied Sciences

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“…Similarly, as well as impurity elements, which segregate to the boundaries, weakening them, there are others which will strengthen the boundaries. Design of engineering alloys (DEA) [67][68][69][70][71][72][73][74] has now become an important field of research with tremendous potential not only for improving the elevated temperature properties of metals and alloys but also improving the room temperature properties. He et al [72] noted that although a lot is known about grain boundary strengthening, little attention has been paid to its effect on mechanical properties, and this is an obvious area for more research.…”

Section: Origin Of the Troughs And Intermediate-temperature Embrittle...mentioning

confidence: 99%

“…Design of engineering alloys (DEA) [67][68][69][70][71][72][73][74] has now become an important field of research with tremendous potential not only for improving the elevated temperature properties of metals and alloys but also improving the room temperature properties. He et al [72] noted that although a lot is known about grain boundary strengthening, little attention has been paid to its effect on mechanical properties, and this is an obvious area for more research. DEA has been used to develop high-entropy alloys (HEA) composed of multiple principal elements with exceptionally high strength and thermal stability, and the optimum strength for these alloys has been derived theoretically and confirmed experimentally, but these are isolated cases [73,74].…”

Section: Origin Of the Troughs And Intermediate-temperature Embrittle...mentioning

confidence: 99%

“…DEA has been used to develop high-entropy alloys (HEA) composed of multiple principal elements with exceptionally high strength and thermal stability, and the optimum strength for these alloys has been derived theoretically and confirmed experimentally, but these are isolated cases [73,74]. DEA also has been used to optimise room-temperature strength in highentropy nano-polycrystalline alloys having Fe, Al, Ni, Cr, and Cu present [72,74]. Cu was shown to be the main element that segregates to the boundaries and strengthens them, but the amount segregating has to be closely controlled, as too much weakens the boundary.…”

Section: Origin Of the Troughs And Intermediate-temperature Embrittle...mentioning

confidence: 99%

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Comments on the Intermediate-Temperature Embrittlement of Metals and Alloys: The Conditions for Transgranular and Intergranular Failure

Salas-Reyes,

Qaban,

Mintz

2024

Metals

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The intermediate-temperature embrittlement range was examined for Fe, Al, Cu, and Ni alloys. It was found that this embrittlement occurs in many alloys, although the causes are very diverse. Embrittlement can be due to fine matrix precipitation, precipitate free zones, melting of compounds at the grain boundaries, segregation of elements to the boundaries, and, additionally for steel, the presence of the soft ferrite film surrounding the harder austenite matrix. Grain boundary sliding and segregation to the boundaries seem to dominate the failure mode at the base of the trough when intergranular failure takes place. When cracking is due to the presence of hydrogen or liquid films at the boundary, then the dissociation along the boundaries is so easy, it is often independent of the strain rate and is always intergranular. In the other cases when failure occurs, if the deformation is carried out at a high strain rate, it is normally transgranular (e.g., hot rolling giving rise to edge cracking). However, when the strain rate is reduced to that of creep (e.g., bending during continuous casting of steel), failure can also take place by grain boundary sliding, and intergranular failure then becomes the favoured mode.

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“…The misorientation between adjacent grains significantly affects the equilibrium GB structure. [ 94 ] Several stable and metastable states exist for different GB orientations, and particular GBs in metals have only recently been observed to have different phases. [ 95 ] A conductive scanning probe method makes it possible to measure the specific resistivity of individual GB.…”

Section: Interconnect Materials and Critical Issuesmentioning

confidence: 99%

Materials Quest for Advanced Interconnect Metallization in Integrated Circuits

et al. 2023

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Integrated circuits (ICs) are challenged to deliver historically anticipated performance improvements while increasing the cost and complexity of the technology with each generation. Front‐end‐of‐line (FEOL) processes have provided various solutions to this predicament, whereas the back‐end‐of‐line (BEOL) processes have taken a step back. With continuous IC scaling, the speed of the entire chip has reached a point where its performance is determined by the performance of the interconnect that bridges billions of transistors and other devices. Consequently, the demand for advanced interconnect metallization rises again, and various aspects must be considered. This review explores the quest for new materials for successfully routing nanoscale interconnects. The challenges in the interconnect structures as physical dimensions shrink are first explored. Then, various problem‐solving options are considered based on the properties of materials. New materials are also introduced for barriers, such as 2D materials, self‐assembled molecular layers, high‐entropy alloys, and conductors, such as Co and Ru, intermetallic compounds, and MAX phases. The comprehensive discussion of each material includes state‐of‐the‐art studies ranging from the characteristics of materials by theoretical calculation to process applications to the current interconnect structures. This review intends to provide a materials‐based implementation strategy to bridge the gap between academia and industry.

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Grain boundary segregation-induced strengthening-weakening transition and its ideal maximum strength in nanopolycrystalline FeNiCrCoCu high-entropy alloys

Cited by 23 publications

References 62 publications

Effect of Segregation on Deformation Behaviour of Nanoscale CoCrCuFeNi High-Entropy Alloy

Effect of Segregation on Deformation Behaviour of Nanoscale CoCrCuFeNi High-Entropy Alloy

Comments on the Intermediate-Temperature Embrittlement of Metals and Alloys: The Conditions for Transgranular and Intergranular Failure

Materials Quest for Advanced Interconnect Metallization in Integrated Circuits

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