Gold wire bond study for automotive application

Papadopoulos, C.; Villiger, T.; Steiner, Simon; Prinz, J.; Morabito, C.; Cammarata, Matteo; Rodriguez, Alexander; Kwon, Jae‐Sung; Geilenkeuser, R.; Breuer, D.; Kuechenmeister, Frank; Dienelt, J.; Urban, Jeffrey J.; Kabus, H.; Krinke, J.

doi:10.1016/j.microrel.2020.113899

Cited by 2 publications

(2 citation statements)

References 5 publications

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“…It is better to choose the purity and diameter of the Au wire according to its working performance requirements in order to ensure the bonding reliability [ 19 ]. Papadopoulos et al [ 24 ] carried out a comparative study of 2N and 4N Au wire bond materials based on Automotive Electronics Council Qualification (AEC-Q100). The results showed that the 4N wire is reaching the lift-off values of AEC-Q100 specification at any case and is well suited up to a temperature of 150 °C, thus meeting the automotive requirements.…”

Section: Au Bonding Wirementioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties. However, the drastic increasing price of Au bonding wire has motivated the industry to search for alternate bonding materials for use in microelectronic packaging such as Cu and Ag bonding wires. The main benefits of using Cu bonding wire over Au bonding wire are lower material cost, higher electrical and thermal conductivity that enables smaller diameter Cu bonding wire to carry identical current as an Au bonding wire without overheating, and lower reaction rates between Cu and Al that serve to improve the reliability performance in long periods of high temperature storage conditions. However, the high hardness, easy oxidation, and complex bonding process of Cu bonding wire make it not the best alternative for Au bonding wire. Therefore, Ag bonding wire as a new alternative with potential application comes to the packaging market; it has higher thermal conductivity and lower electric resistivity in comparison with Cu bonding wire, which makes it a good candidate for power electronics, and higher elastic modulus and hardness than Au bonding wire, but lower than Cu bonding wire, which makes it easier to bond. This paper begins with a brief introduction about the developing history of bonding wires. Next, manufacturability and reliability of Au, Cu, and Ag bonding wires are introduced. Furthermore, general comparisons on basic performance and applications between the three types of bonding wires are discussed. In the end, developing trends of bonding wire are provided. Hopefully, this review can be regarded as a useful complement to other reviews on wire bonding technology and applications.

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Section: Au Bonding Wirementioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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“…Gold wires are used due to their excellent conductivity and corrosion resistance, however, it is expensive and may diffuse. Therefore, an alternative bonding with the aluminium wire exists [3]. Next is the setup of the important parameters of the wire bonder, which are substrate temperature, bonding force, ultrasonic power, and bonding time.…”

Section: Introductionmentioning

confidence: 99%

Study of bonding parameters with Al and Au wires on Pd and Ag coatings

Tomov,

Kolev,

Dobrikov

et al. 2024

J. Phys.: Conf. Ser.

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The process of electrical connection with gold and aluminium wires to palladium and silver electrodes is studied. Parameters of the wire bonding, such as bond force, ultrasonic power, bond time and temperature of the layers, controlled by heating the substrate are varied to explore the reliability of the bonds in terms of mechanical strength, electrical conductivity and interdiffusion of particles between the electrode and functional material at different bonding conditions. The importance of this study is due to the need of electrical connectivity at the stage of wiring and packaging of gas sensors with a novel organic nanomaterial (carbyne), requiring different types of electrodes – Ohmic or Schottky - according to the measurement principle and sensor architecture. Pd and Ag are identified as the most suitable for Ohmic and Schottky contacts, respectively, because of their favourable energy level alignment at the organic/metal interface. The chosen method for bonds testing is measurement of the pull force causing bond failure. The results show that Pd coating was bondable by Au wire, and Ag coating by Al wire, as well as Au on Pd bonds have 4 times higher strength. It is found that the bonding procedure doesn’t affect negatively on the Au/Pd/carbyne interface in terms of diffusion and redistribution of metal particles, but Al/Ag/carbyne is characterized by poor adhesion and the bonds are peeled-off. The results give new knowledge for the fabrication of advanced gas sensors and for the interaction of the carbyne with different metals, which will serve as a base for further optimization of the manufacturing technology toward their commercialization.

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Gold wire bond study for automotive application

Cited by 2 publications

References 5 publications

Research Progress on Bonding Wire for Microelectronic Packaging

Research Progress on Bonding Wire for Microelectronic Packaging

Study of bonding parameters with Al and Au wires on Pd and Ag coatings

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