Global model generation for a capacitive silicon accelerometer by finite-element analysis

Ansel, Yannick; Romanowicz, B.; Renaud, Philippe; Schropfer, G.

doi:10.1016/s0924-4247(98)00011-9

Cited by 8 publications

(5 citation statements)

References 4 publications

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“…For an acceleration sensor, capacitive or optical detection can be implemented. The mass with horizontally located beams could be sensed as a conventional differential capacitance, while the two lateral structures could be sensed capacitively with comb-shaped electrodes [4]. A 3D accelerometer system with optical detection can be fabricated by building three Fabry-Pérot interferometers.…”

Section: Discussionmentioning

confidence: 99%

Collective wet etching of a 3D monolithic silicon seismic mass system

Schropfer¹,

Labachelerie²,

Ballandras³

et al. 1998

J. Micromech. Microeng.

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We present a simple two-step etching process based on anisotropic wet etching of (100) silicon. As one example a system of three seismic masses on one chip has been fabricated. All three masses are symmetrically suspended by four high aspect ratio beams. The highly symmetrical design minimizes mechanical cross-sensitivities. Moreover, the three devices exhibit almost perfect rectangular alignment due to the orientation along the directions of the silicon crystal. Besides experimental results, design rules for the photolithography-masks are presented.

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Section: Discussionmentioning

confidence: 99%

Collective wet etching of a 3D monolithic silicon seismic mass system

Schropfer¹,

Labachelerie²,

Ballandras³

et al. 1998

J. Micromech. Microeng.

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“…In [11], Ansel et al consider a seismic acceleration sensor as a harmonic oscillator. For the modelling a linear differential equation is used for the force f and the deflection x:…”

Section: Identification Of a Harmonic Oscillatormentioning

confidence: 99%

“…A whole range of approaches extract the main corner-stones of the behaviour of a component from measurements or simulations using finite elements and use this for simple models consisting of few equations, see for example Ansel et al [11], Hofmann et al [149], [150], Karam et al [179] and Nagel et al [292]. In what follows three approaches will be considered that aim in the aforementioned direction.…”

Section: Introductionmentioning

confidence: 99%

Mechatronic Systems

Pelz¹

2003

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“…One is fabricated in a (110) wafer with vertical {111} sidewalls as shown in figure 1(b) [2]. Another is formed in a (100) wafer along the 100 direction with {100} vertical sidewalls as shown in figure 1(c) [3]. In either examples [2,3], a capacitive sensing scheme is utilized.…”

Section: Introductionmentioning

confidence: 99%

“…Another is formed in a (100) wafer along the 100 direction with {100} vertical sidewalls as shown in figure 1(c) [3]. In either examples [2,3], a capacitive sensing scheme is utilized.…”

Section: Introductionmentioning

confidence: 99%

langle100rangle composite beam structure formed by masked-maskless etch of silicon

Yang

Bao

et al. 1999

J. Micromech. Microeng.

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A novel micromachined composite beam structure has been designed and fabricated using the maskless anisotropic etching technology for 100 steps. The composite beam consists of two beam sections, a horizontal beam and a vertical beam, linked in series along the 100 direction. The composite beam is compliant in two orthogonal directions: the direction normal to the wafer due to the horizontal beam and the direction parallel with the wafer surface and perpendicular to the beam direction due to the vertical beam. The geometries of the two beam sections can be independently optimized through the process control. By attaching a mass to the end of the beam and integrating piezoresistive bridges on both beam sections, a composite beam-mass structure sensitive to two acceleration components can be formed. This structure can work as a rate gyroscope if the mass is electrostatically driven into vibration in the vertical direction and the Coliois force in the lateral direction is detected by a piezoresistive bridge. The principle, mask design and the process of the 100 masked-maskless etching for the composite beam structure are described and the experimental results on acceleration sensitivities and angular rate are presented.

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Global model generation for a capacitive silicon accelerometer by finite-element analysis

Cited by 8 publications

References 4 publications

Collective wet etching of a 3D monolithic silicon seismic mass system

Collective wet etching of a 3D monolithic silicon seismic mass system

Mechatronic Systems

langle100rangle composite beam structure formed by masked-maskless etch of silicon

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