Global coupled EM-electrical-thermal simulation and experimental validation for a spatial power combining MMIC array

Batty, W.; Christoffersen, C.E.; Yakovlev, Alexander B.; Whitaker, J.F.; Mortazawi, Amir; Al-Zayed, Ayman S.; Ozkar, M.; Ortiz, S.; Reano, Ronald M.; Yang, Kiyull; Katehi, L.P.B.; Snowden, C.M.; Steer, M.B.

doi:10.1109/tmtt.2002.805142

Cited by 27 publications

(14 citation statements)

References 41 publications

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“…In [7], the authors present package thermal models. In [8], the authors present a thermal modeling approach based on analytical solutions of heat transfer equations, and the model is mainly focused at device level. None of these thermal models have the flexibility to model temperature at arbitrary granularity.…”

Section: A Compact Thermal Modelmentioning

confidence: 99%

Compact thermal modeling for temperature-aware design

Huang

Stan

Skadron

et al. 2004

Proceedings of the 41st Annual Design Automation Conference

231

189

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Thermal design in sub-100nm technologies will become one of the major challenges to the CAD community. Using temperature as a guideline for design is very important at sub-100nm. In this paper, we first introduce the idea of temperature-aware design. We then propose a compact thermal model which can be integrated into modern CAD tools to achieve a temperature-aware design. Finally, we use the compact thermal model in a microprocessor design case study to show the importance of using temperature as a guideline for the design. Results from our thermal model show that temperature-aware design approach can provide more accurate design estimations, and therefore better design decisions and faster design convergence.

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Section: A Compact Thermal Modelmentioning

confidence: 99%

Compact thermal modeling for temperature-aware design

Huang

Stan

Skadron

et al. 2004

Proceedings of the 41st Annual Design Automation Conference

231

189

View full text Add to dashboard Cite

show abstract

“…The reason for special treatment to the temperature parameter is to allow electrothermal simulations where the temperature of a device is changing according to the power dissipated by the circuit and its environment. In an electrothermal simulation, the temperature of the device is treated as another controlling voltage [15].…”

Section: A Nonlinear Vccsmentioning

confidence: 99%

Implementation Of Exact Sensitivities In A Circuit Simulator Using Automatic Differentiation

Christoffersen¹

2006

ECMS 2006 Proceedings Edited By: W. Borutzky, A. Orsoni, R. Zobel

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Abstract-Sensitivities are very important in electronic circuit analysis and design. This paper presents a general circuit simulation programme that calculates analytical sensitivities with respect to any parameter using automatic differentiation. A novel aspect of this implementation is that C++ templates are used along with automatic differentiation libraries to produce (at compilation time) different versions of the model evaluation functions, each optimised for a specific purpose. This results in a good compromise between the time to develop and maintain device models and execution efficiency. Algorithms and software design aspects of the circuit simulator are described. Sensitivities of a bipolar self-biasing current source are used to demonstrate the approach.

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“…A variety of power combining schemes have been described in the literature [1][2][3][4][5][6][7][8][9][10][11][12]. Some groups obtained higher power by coherently summing power from several identical input channels in circuitcombining structures [1][2][3].…”

Section: Introductionmentioning

confidence: 99%

“…However, as the number of input channels increases, the losses induced by the mismatch effects of the power combining circuits increase so substantially that the output power will not enhance. Spatial power combining was usually implemented with several associated transmission units in free space to avoid lossy metallic waveguides [4][5][6][7], which can break the limit of the number of sources, form a single beam with low side lobes emission and achieve much larger power density on the target. Unfortunately, this scheme has strict requirements on the relative position and the phase of each element.…”

Section: Introductionmentioning

confidence: 99%

Spatial Microwave Power Combining With Anisotropic Metamaterials

Wang¹

2011

PIER

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Abstract-This paper proposes a novel approach for the spatial microwave power combining. Anisotropic metamatierials are employed to trim the combined electrical fields and form a single beam radiation pattern. The radiation characteristics of a binary horn antennas array are investigated both numerically and experimentally at 12 GHz. The results show that much higher combining efficiency can be achieved. Given a designed combining efficiency, the strict relative position requirements in each transmission unit are reduced in this scheme.

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Global coupled EM-electrical-thermal simulation and experimental validation for a spatial power combining MMIC array

Cited by 27 publications

References 41 publications

Compact thermal modeling for temperature-aware design

Compact thermal modeling for temperature-aware design

Implementation Of Exact Sensitivities In A Circuit Simulator Using Automatic Differentiation

Spatial Microwave Power Combining With Anisotropic Metamaterials

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