Glass Panel Packaging, as the Most Leading-Edge Packaging: Technologies and Applications

Tummala, Rao; DeProspo, Bartlet; Dwarakanath, Shreya; Ravichandran, Siddharth; Nimbalkar, Pratik; Nedumthakady, Nithin; Swaminathan, Madhavan

doi:10.23919/panpacific48324.2020.9059521

Cited by 14 publications

(5 citation statements)

References 9 publications

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“…Heterogeneous integration technologies play a decisive role in developing feature-rich, ultra-compact microwave and mmwave systems. Since transistor downsizing is going to reach its economical and physical limits, there is a clear paradigm shift towards advanced 2.5D and 3D packaging solutions to scale the performance of complex microsystems [15]. In light of this trend, various materials and process technologies have been established to provide ultra-dense multi-chip packaging and wiring [70].…”

Section: Packaging and Interposer Solutionsmentioning

confidence: 99%

“…Therefore, the LTCC technology continues to play an important role even today in high-temperature and highreliability RF applications [14]. From the present perspective, however, multilayered ceramics are limited in terms of their integration density and performance due to material shrinkage during cofiring, low feature-size on internal metal layers and the poor electrical conductivity of the cofired metals [5], [15]. These limitations and the prohibitive fabrication costs of ceramic substates have recently led to the prevalence of multilayered organic substrates in commercial RF applications.…”

Section: Introductionmentioning

confidence: 99%

“…The reason for this was the immaturity of process technologies to reliably realize fine conductor tracks and vias, along with the lack of suitable chip integration techniques. A radically different situation from 15 years ago, nowadays various through glass via technologies have been investigated including mechanical, laser, and gasdischarge drilling as well as hybrid technologies combing wet etching and laser drilling [15] (see Section II-B). Furthermore, silicon-like RDL wiring on glass panels has become feasible by extending semi-additive process (SAP) methods once developed for fabrication of BEOL layers on chips [25].…”

Section: Introductionmentioning

confidence: 99%

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RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

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Driven by the increasing demand for high-throughput communication links and high-resolution radar sensors, the development of future wireless systems pushes at ever greater operating frequencies. By analogy, high-performance computing (HPC) systems with high-bandwidth I/Os have become a mainstream solution to address multi Gbit/s data rates. Heterogeneous integration technologies play a vital role here in enhancing the performance and functional density, along with reducing the size and costs of such RF systems. In line with this trend, many passive components, which have once been monolithically integrated, are now implemented on ceramic or polymer-based packages. Besides these long-established material and process technologies, considerable efforts have also recently been devoted to the development of RF components on glass and glass-ceramics. Spurred by their low dielectric losses, extremely smooth surfaces, and excellent dimensional stability, glass technologies are emerging as a promising alternative for high-volume and high-performance RF applications. In this article, relevant glass materials and key enabling technologies are reviewed and put into context with well-established RF substrate technologies. Another focus is set on the latest glass-based packaging and interposer solutions ranging from MHz-to-THz frequencies. To showcase the development activities and practical accomplishments of the RF glass technology, also a large variety of key components is presented. Finally, the paper concludes by discussing future research and development directions of RF glass devices.INDEX TERMS MTT 70th Anniversary Special Issue, glass technology, dielectrics, packaging, interposer, system-on-package, interconnects, filters, antennas, antenna-in-package, millimeter wave (mm-wave).

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Section: Packaging and Interposer Solutionsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

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“…BEOL RDLs, however, suffer from the disadvantage of higher cost due to smaller wafer-size processing. With recent advances in glass interposers, this issue has now been addressed by providing a panel-sized solution, thus lowering the cost of high-density substrates [13,14]. Additionally, panel-scale processing is critical for the manufacturing of large body-size interposers and substrates, which are less economical at the wafer scale.…”

Section: Fabrication and Processingmentioning

confidence: 99%

“…The sharp increase in resistance at 1500 cycles was attributed to the cracking at the microvia-pad interface observed in Figure 10c. Glass-based interposer substrates are gaining importance due to their tunable CTE for optimizing board-level reliability [14]. However, because of the brittle nature of glass, cracking of the glass core is a challenge.…”

Section: Thermal Cycling Reliabilitymentioning

confidence: 99%

A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates

Nimbalkar,

Bhaskar,

Kathaperumal

et al. 2023

Polymers

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The ever-increasing demand for faster computing has led us to an era of heterogeneous integration, where interposers and package substrates have become essential components for further performance scaling. High-bandwidth connections are needed for faster communication between logic and memory dies. There are several limitations to current generation technologies, and dielectric buildup layers are a key part of addressing those issues. Although there are several polymer dielectrics available commercially, there are numerous challenges associated with incorporating them into interposers or package substrates. This article reviewed the properties of polymer dielectric materials currently available, their properties, and the challenges associated with their fabrication, electrical performance, mechanical reliability, and electrical reliability. The current state-of-the-art is discussed, and guidelines are provided for polymer dielectrics for the next-generation interposers.

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