Glass Multilayer Package Substrate using Conductive Paste Via Connection

Iwai, Tsuruji; Sakai, Taiji; Mizutani, Daisuke; Sakuyama, Seiki; Iida, Kenji; Inaba, Takayuki; Fujisaki, Hidehiko; Tamura, Akira; Miyazawa, Yoshinori

doi:10.1109/icsj.2018.8602741

Cited by 7 publications

(3 citation statements)

References 6 publications

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“…The next steps for this work are to include the simulation of complete SimTEC devices in the glass interposer underneath the electronic integrated chips (EICs) and photonic integrated chips (PICs) and analyze the active temperature control of the PIC/EIC. The authors also envision that the SimTEC architecture can be expanded to a multilayered glass substrate, 33 where the thin glass substrate layer with SimTEC can be stacked on top of the glass substrate layer with SimTEG. This will enable the heat load pumped out from the hot side of the SimTEC layer to be used as an input by the SimTEG layer 34 for power generation in the package.…”

Section: Future Workmentioning

confidence: 99%

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Gupta,

Tanwar,

et al. 2024

J. Optical Microsystems

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Managing the temperature of photonic chips within intricate electro-optic packages poses a notable challenge concerning the thermal crosstalk between the photonic chip, electronic chip, and the chip-fiber connection point. This is a multifaceted problem and requires packaging solutions that cannot only address high-performance thermal management but must also be scalable to high volumes. Glass has long been thought of as a suitable platform for next-generation photonic packaging due to its low thermal conductivity, which minimizes unwanted heat transfer between electronic and photonic components. Achieving proper thermal isolation between the chips and the chip-fiber interface necessitates a microscale thermal solution that guarantees accurate temperature regulation of the photonic circuitry without disrupting the optical coupling interface with the fiber array, due to the presence of epoxy used for fiber attachment. We propose a technique for the development of a substrate-integrated microthermoelectric cooler (SimTEC) for the effective temperature control of the electronic and photonic integrated devices. The proposed device uses glass substrate vias that are half-filled with p and n-type thermoelectric materials and the other half with copper. A COMSOL multiphysics model is developed to study the variations in the cooling performance of this SimTEC device based on changes in the via parameters. Interestingly, the maximum range of temperature gradient variation for SimTEC is 6 times greater compared to that of equivalent free-standing micro-TEC pillars. However, there are some challenges associated with implementing this method, as the temperature gradient (or cooling effect) achieved by SimTEC still falls short of that achieved by the free-standing micro-TEC pillars.

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Section: Future Workmentioning

confidence: 99%

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Gupta,

Tanwar,

et al. 2024

J. Optical Microsystems

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show abstract

“…The resistivity of the filled vias was 2-4 orders of magnitude higher than that of bulk copper. Iwai et al (2018a), Iwai et al (2018b), and Iwai et al (2019) in Fujitsu Laboratory filled TGVs in a multi-layer glass package substrate with copper paste and sintered them by a vacuum hot-pressing machine. The single hole resistance was 5.2 mΩ, and the resistivity was 0.26 μΩ•cm.…”

Section: Microvia Filling Performance Of Metal Nano/ Microparticle Co...mentioning

confidence: 99%

A Mini Review on the Microvia Filling Technology Based on Printed Metal Nano/Microparticles

Yang

Luo

et al. 2022

Front. Mater.

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Microvia filling is a core interconnection technique in electronic manufacturing. Electroplating is the primary method used in the industry for filling microvias but also has the drawbacks of cumbersome procedures and toxic by-products. New microvia filling technology through printing of metal particle–based conductive fillers was then developed, with the advantages of simpler process, higher efficiency, better compatibility, and eco-friendliness. Here, we review the up-to-date research findings on the microvia filling technology based on printed metal nano/microparticles from the perspectives of material development and filling performance. Some key questions about this technology are also discussed. We hope the outlook presented by this review could help the further studies on this topic. The review also identifies some key remaining issues to be resolved.

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“…Compared with other metal particle conductive inks with relatively low solid content (40~50 wt.% [ 23 ]), and metal particle conductive adhesives with undecomposable organic additives such as film-forming agents and cross-linking agents [ 24 ], the Cu@Ag particle paste is able to reach better sinterability and conductivity. In terms of filling method, previous studies have tried screen printing [ 25 , 26 , 27 ], squeegee printing [ 28 ], and inkjet printing [ 7 ]. However, the filling performance of these methods are unsatisfactory, as the evaporation of solvents will lead to shrinkage cavities in the structure.…”

Section: Introductionmentioning

confidence: 99%

A Green and Facile Microvia Filling Method via Printing and Sintering of Cu-Ag Core-Shell Nano-Microparticles

et al. 2022

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In this work, we developed an eco-friendly and facile microvia filling method by using printing and sintering of Cu-Ag core-shell nano-microparticles (Cu@Ag NMPs). Through a chemical reduction reaction in a modified silver ammonia solution with L-His complexing agent, Cu@Ag NMPs with compact and uniform Ag shells, excellent sphericity and oxidation resistance were synthesized. The as-synthesized Cu@Ag NMPs show superior microvia filling properties to Cu nanoparticles (NPs), Ag NPs, and Cu NMPs. By developing a dense refill method, the porosity of the sintered particles within the microvias was significantly reduced from ~30% to ~10%, and the electrical conductivity is increased about twenty-fold. Combing the Cu@Ag NMPs and the dense refill method, the microvias could obtain resistivities as low as 7.0 and 6.3 μΩ·cm under the sintering temperatures of 220 °C and 260 °C, respectively. The material and method in this study possess great potentials in advanced electronic applications.

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Glass Multilayer Package Substrate using Conductive Paste Via Connection

Cited by 7 publications

References 6 publications

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

A Mini Review on the Microvia Filling Technology Based on Printed Metal Nano/Microparticles

A Green and Facile Microvia Filling Method via Printing and Sintering of Cu-Ag Core-Shell Nano-Microparticles

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