Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging

Merget, Florian; Ackermann, Manuel; Shen, Bin; Saunders, Gunter; Haag, Sebastian; Wölz, Martin; Witzens, Jeremy

doi:10.1109/ecoc52684.2021.9605906

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Molded Glass Micro-optical Interposers1

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2024

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“…We have adapted an isothermal glass molding process to form micro-optical interposers for coupling between a fiber array unit (FAU) and surface emitting/receiving couplers of a PIC in a compact assembly rising less than 2.7 mm above the surface of the PIC (Fig. 1) [7]. For each parallel channel, a pair of lenses images and reshapes a beam between a single mode (SM) fiber and the PIC [8].…”

Section: Molded Glass Micro-optical Interposersmentioning

confidence: 99%

Scalable PIC packaging and polarization control in CPO

Merget,

Ackermann,

Shen

et al. 2024

Integrated Photonics Platforms III

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The emergence of co-packaged optics and of parallel optics pluggable form factors with an increased number of fibers poses new challenges for optical packaging technologies. We describe micro-optical interposers manufactured with isothermal glass molding that enable the parallelized connection of large fiber arrays with photonic integrated circuits in a low-rise form factor as well as the management of scrambled light polarization from a remote laser source coupled by single mode fiber. A resonantly assisted but temperature tolerant silicon photonics Mach-Zehnder modulator operated in lumped element configuration is co-developed for that purpose and a concept for a 6.4 Tb/s bi-directional light engine described.

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Section: Molded Glass Micro-optical Interposersmentioning

confidence: 99%