Glass in Electronic Packaging and Integration: High Q Inductances for 2.35 GHz Impedance Matching in 0.05 mm Thin Glass Substrates

Wu, Zihan; Viswanathan, Sukhadha; Jotz, Matthias; Maune, Holger; Jost, Matthias; Raj, P. Markondeya; Sundaram, Venkatesh; Tummala, Rao

doi:10.1109/ectc.2018.00167

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-D Ipd Fabrication Process1

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“…3-D IPD processes have emerged with the potential to enhance performance and integration densities when compared to conventional planar IPD technologies [22,23,24,25,26].…”

Section: -D Ipd Fabrication Processmentioning

confidence: 99%

Compact and wideband 3-D IPD butler matrix for millimeter-wave communications

Cayron,

Viallon,

Ghannam

et al. 2024

AEU - International Journal of Electronics and Communications

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“…3-D IPD processes have emerged with the potential to enhance performance and integration densities when compared to conventional planar IPD technologies [22,23,24,25,26].…”

Section: -D Ipd Fabrication Processmentioning

confidence: 99%