Glass in wafer- and panel-level packaging: Changes, challenges, hurdles and barriers

Letz, Martin; Gotschke, Tobias; Hoppe, B.; Heiss, M. M.; Jotz, Matthias

doi:10.23919/iwlpc52010.2020.9375893

2020 International Wafer Level Packaging Conference (IWLPC) 2020

DOI: 10.23919/iwlpc52010.2020.9375893

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Glass in wafer- and panel-level packaging: Changes, challenges, hurdles and barriers

Martin Letz

Tobias Gotschke

B. Hoppe

et al.

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Glass in wafer- and panel-level packaging: Changes, challenges, hurdles and barriers

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References 21 publications

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