We studied the energy-level
alignment at interfaces between various
transition-metal dichalcogenide (TMD) monolayers, MoS
2
,
MoSe
2
, WS
2
, and WSe
2
, and metal electrodes
with different work functions (WFs). TMDs were deposited on SiO
2
/silicon wafers by chemical vapor deposition and transferred
to Al and Au substrates, with significantly different WFs to identify
the metal–semiconductor junction behavior: oxide-terminated
Al (natural oxidation) and Au (UV–ozone oxidation) with a WF
difference of 0.8 eV. Kelvin probe force microscopy was employed for
this study, based on which electronic band diagrams for each case
were determined. We observed the Fermi-level pinning for MoS
2
, while WSe
2
/metal junctions behaved according to the
Schottky–Mott limit. WS
2
and MoSe
2
exhibited
intermediate behavior.