The fabrication of topological-switching randomaccess memory (TRAM), a new type of phase change memory, was investigated. The deposition and etching process technologies of a GeTe/Sb 2 Te 3 superlattice memory cell were developed and micro test structures of TRAM were fabricated. Analysis of the fabricated structures revealed that the electrical properties of TRAM were different from those of conventional phase change memory and the reset voltage of TRAM, 0.6 V, was less than that of PRAM, 1 V. The non-melting behaviors of resistance change in TRAM were clarified via thermal-conductivity measurements and device simulation.