Gelling of chips during vertical surface diamond grinding of BK7 glass

Izman, S.; Venkatesh, V.C.

doi:10.1016/j.jmatprotec.2006.03.140

Cited by 16 publications

(7 citation statements)

References 7 publications

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“…The glass simulations were carried out using systems of 4200, 4320 and 4720 particles for silica (SiO 2 ), BK7 (a borosilicate glass containing small amounts of potassium and sodium oxides, with approximate formula (SiO 2 ) 66 (B2O 3 ) 15 (K 2 O) 3 (Na 2 O) 8 ), and alumina (Al 2 O 3 ) glasses, respectively. Each glass was first pre-equilibrated under constant NVT conditions at 4000 K, using a Nos e-Hoover thermostat with time constant of 0.5 ps, and a density set to the corresponding room-temperature experimental value, [18][19][20] using cubic simulation boxes with sides of around 2.5 nm. These high temperature/high energy simulation runs lasted for just 10 ps with a 1 fs timestep and were immediately followed by a temperature quench from 4000 K to 300 K at a rate of 10 K ps À1 .…”

Section: Glass Simulationmentioning

confidence: 99%

2D or not 2D: Structural and charge ordering at the solid-liquid interface of the 1-(2-hydroxyethyl)-3-methylimidazolium tetrafluoroborate ionic liquid

et al. 2012

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Molecular dynamics simulations of a 5 nm-thick layer of the ionic liquid 1-(2-hydroxyethyl)-3-methylimidazolium tetrafluoroborate, [(OH)C2C1im][BF4], over silica, alumina and boro-silicate glass substrates have been performed. The structure of the ionic liquid at the solid-liquid interface has been interpreted taking into account the corresponding normal density profiles, lateral interfacial structure, orientational ordering and planar density contours. Comparisons with experimental data suggest that the adsorption and stratification process of ionic liquids over solid substrates can be correctly modeled using a realistic rendition of a non-uniform amorphous substrate such as a glass material.

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Section: Glass Simulationmentioning

confidence: 99%

2D or not 2D: Structural and charge ordering at the solid-liquid interface of the 1-(2-hydroxyethyl)-3-methylimidazolium tetrafluoroborate ionic liquid

et al. 2012

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“…7]. Zero velocity effect at the centre of PCD tool could be the reason of this dragging track, which trap chips and drag them along the cutting path without cutting [12]. Moreover, some pores are found on machined surface presented in Fig.…”

Section: Resultsmentioning

confidence: 99%

Cutting Force Analysis of on-Machine Fabricated PCD Tool during Glass Micro-Grinding

Perveen

Jahan

Wong

et al. 2011

AMR

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Brittle and hard materials are problematic to mechanically micro machine due to damage resulting from material removal by brittle fracture, cutting force-induced tool deflection or breakage and tool wear. As a result, the forces arising from the cutting process are important parameter for material removal. This study was undertaken to investigate the effect of cutting conditions on cutting forces and the machined surface during the glass micro grinding using on-machine fabricated (Poly Crystalline Diamond) PCD tool. Experimental results showed that an increase in depth of cut and feed rate can result in increase of cutting forces and surface roughness as well. Among the forces in 3 axes, force along feed direction is found to be larger, which played a major role in material removal. Finally, it is observed that PCD tool exhibits promising behaviour to machine brittle material like BK-7 glass for producing micro molds and micro fluidic devices, since it has better wear resistance, experiences less cutting forces and generates smooth surfaces with Ra value of as low as 12.79 nm.

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“…Since the average surface roughness (R a ) is the most commonly used and large amounts of ductile streaks favor low surface roughness [16], R a and the smaller-the-better characteristic were selected in this study. This study also chose depths of cut, feed rates and spindle speeds as grinding parameters as were the case with previous work [8,9,10,17]. These parameters were set at three levels as shown in Table 1 The levels for the spindle speed were based on the workable range as specified by the manufacturer of the NSK Planet 850.…”

Section: Advances In Materials and Processing Technologies IImentioning

confidence: 99%

“…These parameters were set at three levels as shown in Table 1 The levels for the spindle speed were based on the workable range as specified by the manufacturer of the NSK Planet 850. The levels for feed rates and depths of cut were selected based on the previous reported data of the authors [8,9,10]. An L 9 (3 4 ) OA was finally chosen for the experiments.…”

Section: Advances In Materials and Processing Technologies IImentioning

confidence: 99%

“…Precision grinding can be used for this purpose by proper selection of grinding parameters. Researchers [7,8,9,10] have machined hard-brittle materials paying considerable attention to the generation of massive ductile surfaces while little attention has been paid to the optimization of the precision grinding process. In order to get good surface quality on ground silicon surfaces, it becomes necessary to employ optimization techniques to find optimal grinding conditions that favour low surface roughness and massive ductile surfaces.…”

Section: Introductionmentioning

confidence: 99%

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Optimization of Precision Grinding Parameters of Silicon for Surface Roughness Based on Taguchi Method

Alao

Konneh

2011

AMR

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Silicon being a typical hard-brittle material is difficult to machine to a good surface finish. Although ductile-mode machining (DMM) is often employed to machine this advanced material but this technique requires the use of expensive ultra-precision machine tools therefore limiting its applicability. However, by proper selection of grinding parameters, precision grinding which can be performed on conventional machine tools can be used to generate massive ductile surfaces thereby reducing the polishing time and improving the surface quality. Precision grinding should be planned with reliability in advance and the process has to be performed with high rates of reproducibility. Therefore, this study investigated the effect and optimization of grinding parameters using Taguchi optimization technique during precision grinding of silicon. Experimental studies were conducted under varying depths of cut, feed rates and spindle speeds. An orthogonal array (OA), signal-to-noise (S/N) ratio and the analysis of variance (ANOVA) were employed to find the minimum surface roughness value and to analyze the effect of the grinding parameters on the surface roughness. Confirmation tests were carried out in order to illustrate the effectiveness of the Taguchi method. The results show that feed rate mostly affected the surface roughness. The predicted roughness (Ra) of 34 nm was in agreement with the confirmation tests. Massive ductilestreaked surface was also found corresponding to the minimal surface finish determined from the optimal levels.

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Gelling of chips during vertical surface diamond grinding of BK7 glass

Cited by 16 publications

References 7 publications

2D or not 2D: Structural and charge ordering at the solid-liquid interface of the 1-(2-hydroxyethyl)-3-methylimidazolium tetrafluoroborate ionic liquid

2D or not 2D: Structural and charge ordering at the solid-liquid interface of the 1-(2-hydroxyethyl)-3-methylimidazolium tetrafluoroborate ionic liquid

Cutting Force Analysis of on-Machine Fabricated PCD Tool during Glass Micro-Grinding

Optimization of Precision Grinding Parameters of Silicon for Surface Roughness Based on Taguchi Method

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