Gate–Emitter Pre-threshold Voltage as a Health-Sensitive Parameter for IGBT Chip Failure Monitoring in High-Voltage Multichip IGBT Power Modules

Mandeya, Richard; Chen, Cuili; Pickert, Volker; Naayagi, R. T.; Ji, Bing

doi:10.1109/tpel.2018.2884276

Cited by 51 publications

(15 citation statements)

References 37 publications

(34 reference statements)

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“…Hence the reliability of IGBT needs to be evaluated to get PV inverter reliability. The temperature at the junction layers of the IGBT varies with mission profile variations and leads to failure (bond wire liftoff, wear out, etc.,) [14,15]. Hence junction temperature needs to be calculated for reliability evaluation.…”

Section: Reliability Evaluation Of Pv Invertermentioning

confidence: 99%

Impact of Solar Irradiance and Ambient Temperature on PV Inverter Reliability Considering Geographical Locations

Kshatri¹,

Dhillon²,

Mishra³

2021

IJHT

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Today inverter system is one of the enabling technologies for efficiently harnessing energy from renewable energy sources (Solar, Wind, etc.,) and also for high reliable grid interfacing systems. With the advancements in power electronics, inverter conversion efficiency pushed to 98%, also PV is becoming a major renewable energy source globally. Nevertheless, the reliability performance of PV inverter is of high concern. Different environmental factors like solar irradiance, ambient temperature (also called Mission Profile) affect the reliability performance of PV inverter. Environmental conditions vary from location to location. Hence to quantify the reliability performance of PV inverter all these factors need to be considered. In this paper reliability performance of PV inverter is evaluated considering environmental factors and geographical locations. For the reliability evaluation, a 1-ϕ, 3-kW grid connected PV system is developed in PLECS. Full bridge PV inverter with 600V/30A IGBT is employed as the interface between grid and PV source. Real time mission profile data of one-year logs at India (Relatively hot climate) and Denmark (Relatively cold climate) to account for environmental factors and geographical locations during the reliability performance evaluation of PV inverter. Monte Carlo simulation is used to generate a population of 20000 samples with 5% variation. Lifetime for 20000 samples is calculated and fitted in Two Parameter Weibull distribution. B10 lifetime is calculated at two locations. The results of this paper reveal that environmental factors and geographical locations have a significant impact on PV inverter reliability performance.

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Section: Reliability Evaluation Of Pv Invertermentioning

confidence: 99%

Impact of Solar Irradiance and Ambient Temperature on PV Inverter Reliability Considering Geographical Locations

Kshatri¹,

Dhillon²,

Mishra³

2021

IJHT

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“…-= JC th TT R P (3) Bond wires lift-off is one of the major failure mechanisms in IGBT module [9], previous researchers had studied a lot of effects of bond wires lift-off on gate voltage [10], conduct voltage [11], or threshold voltage [12]. However, there is still not much study on the effect of lift-off on thermal resistance measurement.…”

Section: R Th = R Die + R D−s + R Dbc + R B−s + R Basementioning

confidence: 99%

“…R th = T J − T C P = ∆T P D + P WB_D (11) Although the rise of junction temperature is caused by P , the total power dissipation of whole module P M is measured as the calculated power dissipation in thermal resistance measurement. The relationship between P M and P is shown in (12). P M = P D + P WB = ( P D + P WB_D ) + P WB_E = P + P WB_E (12) Using the module's power dissipation to measure thermal resistance will lead to a higher calculated power dissipation than the theoretical value.…”

Section: Wb_d P' P P =+ (9)mentioning

confidence: 99%

“…The relationship between P M and P is shown in (12). P M = P D + P WB = ( P D + P WB_D ) + P WB_E = P + P WB_E (12) Using the module's power dissipation to measure thermal resistance will lead to a higher calculated power dissipation than the theoretical value. This difference between two power dissipation causes a reduction in measured results R JC-M after lift-off, which is lower than the theoretical value, as in (13).…”

Section: Wb_d P' P P =+ (9)mentioning

confidence: 99%

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A Study on the Effect of Bond Wires Lift-Off on IGBT Thermal Resistance Measurement

et al. 2021

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Bond wire lift-off will cause an increase of remaining wires’ power dissipation, which usually is ignored for healthy modules. However, only partial wires’ power dissipation transfers through thermal path from junction to case, which will lead to overestimate the whole power dissipation from collector to emitter pole and underestimate the calculated thermal resistance using the proportion of temperature difference to power dissipation. A FEM model is established to show the change of heat flow after bond wires were removed, the temperature of bond wires increases, and the measured thermal resistance decrease after bond wires lift-off. It is validated by experimental results using open package Insulated Gate Bipolar Transistor (IGBT) modules under different current conditions. This conclusion might be helpful to indicate the bond wires lift-off and solder fatigue by comparing the change of measured thermal resistance. Using the Kelvin setup to measure thermal resistance will cause misjudgment of failure mode due to the ignoring of wires’ power dissipation. This paper proposed that the lift-off of bond wires will lead to underestimating the thermal resistance measurement, which will overestimate the lifetime of IGBT module and misjudge its state of health.

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“…In [18], the aging process of the solder layer was monitored through the thermal resistance of the IGBT module, and the equivalent thermal network model parameters were updated in real-time accordingly. In [19], the author detected the IGBT chips in the multi-chip IGBT power module through the gate turn-on threshold voltage and accurately judged the number of faulty chips for early warning. In [20], the aging state of the IGBT was monitored by monitoring the difference of the short-circuit current, and the experiment proved that this parameter was little affected by the junction temperature.…”

Section: Introductionmentioning

confidence: 99%

A Fusion Algorithm for Online Reliability Evaluation of Microgrid Inverter IGBT

Wang

et al. 2020

Electronics

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Due to the diversity of distributed generation sources, microgrid inverters work under complex and changeable conditions. The core device of inverters, an insulated gate bipolar transistor (IGBT), bears a large amount of thermal stress impact, so its reliability is related to the stable operation of the microgrid. The effect of the IGBT aging process cannot be considered adequately with the existing reliability evaluation methods, which have not yet reached the requirements of online evaluation. This paper proposes a fusion algorithm for online reliability evaluation of microgrid inverter IGBT, which combines condition monitoring and reliability evaluation. Firstly, based on the microgrid inverter topology and IGBT characteristics, an electrothermal coupling model is established to obtain junction temperature data. Secondly, the segmented long short-term memory (LSTM) algorithm is studied, which can accurately predict the aging process of the IGBT and judge the aging state via the limited monitoring data. Then, the parameters of the electrothermal coupling model are corrected according to the aging process. Besides, the fusion algorithm is applied to the practical case. Finally, the data comparison verifies the feasibility of the fusion algorithm, whose cumulative damage degree and estimated life error are 5.10% and 5.83%, respectively.

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Gate–Emitter Pre-threshold Voltage as a Health-Sensitive Parameter for IGBT Chip Failure Monitoring in High-Voltage Multichip IGBT Power Modules

Cited by 51 publications

References 37 publications

Impact of Solar Irradiance and Ambient Temperature on PV Inverter Reliability Considering Geographical Locations

Impact of Solar Irradiance and Ambient Temperature on PV Inverter Reliability Considering Geographical Locations

A Study on the Effect of Bond Wires Lift-Off on IGBT Thermal Resistance Measurement

A Fusion Algorithm for Online Reliability Evaluation of Microgrid Inverter IGBT

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