2009
DOI: 10.1143/apex.2.111003
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GaN-Based Integrated Lateral Thermoelectric Device for Micro-Power Generation

Abstract: Lateral thermoelectric devices were fabricated using c-plane GaN thin films grown on sapphire by MOCVD. The device design is appropriate for on-chip integration for power generation in the 1 V and tens of µA range. The fabricated devices were measured to have a maximum open circuit voltage of 0.3 V with a maximum output power of 2.1 µW (=0.15 V×14 µA) at a relatively small temperature difference (ΔT) of 30 K and an average temperature (Tavg) of 508 K. In addition, the suitability of GaN for high temperature th… Show more

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Cited by 61 publications
(42 citation statements)
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“…InN is promising for TE applications since the large size of indium atoms potentially increases phonon scattering and accordingly reduce the thermal conductivity. 101 The highest reported ZT is about 1.6 for a 6 nm InN nanowire at 1000 K, which is 100 times larger than that at room temperature. 105 Hybrid, InN and Al 0.25 In 0.75 N devices structures prepared by radio-frequency (RF) sputtering have been fabricated.…”
Section: The Iii-nitrides For Thermoelectric Energy Harvestingmentioning
confidence: 94%
See 1 more Smart Citation
“…InN is promising for TE applications since the large size of indium atoms potentially increases phonon scattering and accordingly reduce the thermal conductivity. 101 The highest reported ZT is about 1.6 for a 6 nm InN nanowire at 1000 K, which is 100 times larger than that at room temperature. 105 Hybrid, InN and Al 0.25 In 0.75 N devices structures prepared by radio-frequency (RF) sputtering have been fabricated.…”
Section: The Iii-nitrides For Thermoelectric Energy Harvestingmentioning
confidence: 94%
“…These were typically multijunction hybrid devices that were constructed from freestanding or epitaxial hydride vapor phase epitaxy (HVPE) grown GaN. 101,102 For example, a 3-pair epitaxial GaN layers device structure was fabricated for the purpose of on-chip integration. 103 In these prototypes of devices chromel was sputtered onto the SiO 2 glass substrate and then the GaN was physically soldered on.…”
Section: The Iii-nitrides For Thermoelectric Energy Harvestingmentioning
confidence: 99%
“…8 The potential of III-nitride materials for thermoelectric applications has motivated increasing research on the experimental properties of GaN, 9,10 InGaN, 3,5,11,12 InAlN, [13][14][15] and AlInGaN 16,17 as well as III-nitride based thermoelectric devices. 18 There have also been a few attempts to calculate and predict the properties of these materials, most notably the thermoelectric properties of GaN, 4 AlGaN, 4,19 and InGaN. 19,20 These studies all use the Boltzmann transport equation (BTE) with the relaxation time approximation (RTA) to calculate the electrical transport properties and the Callaway model along with the virtual crystal approximation for phonon transport.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, III-nitride semiconductors have been widely employed for energy-efficiency device technologies, including light-emitting diodes (LEDs) for solid state lighting [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19], visible diode lasers for both display and biosensing [20][21][22][23][24][25][26], photovoltaics and solar energy conversion [27][28][29], and thermoelectric heat conversion and active cooling materials [30][31][32][33][34][35][36][37][38][39]. In designing structures in nitride-based devices for photonics and electronics applications, the most-widely studied heterostructures have been primarily limited to AlGaN/GaN and InGaN/GaN configurations.…”
Section: Introductionmentioning
confidence: 99%