Gallium arsenide IC technology for power supplies on chip

Pala, Vipindas; Peng, Han; Hella, Mona M.; Chow, T. Paul

doi:10.1109/ipec.2014.6869895

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“…One of the most effective ways of shrinking the volume of the power supply is to reduce the volume of passive components by increasing the switching frequency. [1][2][3][4][5][6][7][8][9] Therefore, the switching frequency of the power SoC is required to be more than 10 MHz.…”

Section: Introductionmentioning

confidence: 99%

Impact of three-dimensional stacked power supply on chip for high-frequency DC–DC converter

Hiura

Ikeda

Hino

et al. 2017

Jpn. J. Appl. Phys.

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In this paper, we propose a three-dimensional (3D) stacked power supply on chip (SoC), which comprises stack of a GaN power device, Si-LSI, and passive devices to reduce the parasitic impedance. We also evaluate the 3D stacked power SoC by electromagnetic and circuit simulations in a 3 ' 3 mm 2 square chip. In addition, we clarify the impact of the 3D stacked power SoC for a high-frequency DC-DC converter against the printed circuit board (PCB)-based DC-DC converter. The efficiency of the 3D stacked power SoC is always higher than that of the conventional GaNbased DC-DC converter.

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