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2015
DOI: 10.1016/j.mssp.2015.05.058
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GaAsP on SiGe/Si material quality improvements with in-situ stress sensor and resulting tandem device performance

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Cited by 13 publications
(14 citation statements)
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References 26 publications
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“…The nþ/p GaAsP top cell is targeted to be lattice-matched at growth temperature with the SiGe layers below and current-matching with the SiGe bottom cell [21]. The Te doped GaAsP contact layer has a targeted dopant density of 2 Â 10 20 cm À 3 for reduced contact resistance.…”
Section: Structure Designmentioning
confidence: 99%
See 3 more Smart Citations
“…The nþ/p GaAsP top cell is targeted to be lattice-matched at growth temperature with the SiGe layers below and current-matching with the SiGe bottom cell [21]. The Te doped GaAsP contact layer has a targeted dopant density of 2 Â 10 20 cm À 3 for reduced contact resistance.…”
Section: Structure Designmentioning
confidence: 99%
“…The pþ/nþ tunnel-junction (TJ) for this tandem structure lies within the III-V layers with a targeted dopant density of 2 Â 10 19 cm À 3 and 2 Â 10 20 cm À 3 , respectively. With evidence that GaInP provides better nucleation than GaAsP [21], a 200 nm thick GaInP nucleation layer is used between the SiGe growth layers and the subsequent III-V growth layers. The n/p SiGe bottom cell targets a bandgap of 0.86 eV with a germanium concentration of 82% to match the SiGe graded buffer final Ge concentration.…”
Section: Structure Designmentioning
confidence: 99%
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“…Crystalline silicon solar cell has continued dominating the solar energy market [1]. Yet, III-V solar cell has the highest conversion efficiency in the world [2]. However, this device has high cost, making it diffcult to command the solar cell market.…”
Section: Introductionmentioning
confidence: 99%