“…The nþ/p GaAsP top cell is targeted to be lattice-matched at growth temperature with the SiGe layers below and current-matching with the SiGe bottom cell [21]. The Te doped GaAsP contact layer has a targeted dopant density of 2 Â 10 20 cm À 3 for reduced contact resistance.…”
Section: Structure Designmentioning
confidence: 99%
“…The pþ/nþ tunnel-junction (TJ) for this tandem structure lies within the III-V layers with a targeted dopant density of 2 Â 10 19 cm À 3 and 2 Â 10 20 cm À 3 , respectively. With evidence that GaInP provides better nucleation than GaAsP [21], a 200 nm thick GaInP nucleation layer is used between the SiGe growth layers and the subsequent III-V growth layers. The n/p SiGe bottom cell targets a bandgap of 0.86 eV with a germanium concentration of 82% to match the SiGe graded buffer final Ge concentration.…”
Section: Structure Designmentioning
confidence: 99%
“…As the lattice constant for GaAsP varies from 5.45 to 5.65 depending on composition, this work targets a lattice constant of 5.61 with a 20% P composition to match the lattice of the 82% Ge SiGe bottom cell [22]. A TDD of 6.2 Â 10 6 cm À 2 has been previously reported for III-V layers on SiGe [21]. The simplified device structure details are shown in Fig.…”
Section: Materials Growthmentioning
confidence: 99%
“…4 [21] whereas more recent improvements in material quality have led to a TDD of 2.8 Â 10 6 cm À 2 in the III-V layers as shown in Fig. 5 and measured by electron beam-induced current (EBIC) [24].…”
“…The nþ/p GaAsP top cell is targeted to be lattice-matched at growth temperature with the SiGe layers below and current-matching with the SiGe bottom cell [21]. The Te doped GaAsP contact layer has a targeted dopant density of 2 Â 10 20 cm À 3 for reduced contact resistance.…”
Section: Structure Designmentioning
confidence: 99%
“…The pþ/nþ tunnel-junction (TJ) for this tandem structure lies within the III-V layers with a targeted dopant density of 2 Â 10 19 cm À 3 and 2 Â 10 20 cm À 3 , respectively. With evidence that GaInP provides better nucleation than GaAsP [21], a 200 nm thick GaInP nucleation layer is used between the SiGe growth layers and the subsequent III-V growth layers. The n/p SiGe bottom cell targets a bandgap of 0.86 eV with a germanium concentration of 82% to match the SiGe graded buffer final Ge concentration.…”
Section: Structure Designmentioning
confidence: 99%
“…As the lattice constant for GaAsP varies from 5.45 to 5.65 depending on composition, this work targets a lattice constant of 5.61 with a 20% P composition to match the lattice of the 82% Ge SiGe bottom cell [22]. A TDD of 6.2 Â 10 6 cm À 2 has been previously reported for III-V layers on SiGe [21]. The simplified device structure details are shown in Fig.…”
Section: Materials Growthmentioning
confidence: 99%
“…4 [21] whereas more recent improvements in material quality have led to a TDD of 2.8 Â 10 6 cm À 2 in the III-V layers as shown in Fig. 5 and measured by electron beam-induced current (EBIC) [24].…”
“…Crystalline silicon solar cell has continued dominating the solar energy market [1]. Yet, III-V solar cell has the highest conversion efficiency in the world [2]. However, this device has high cost, making it diffcult to command the solar cell market.…”
We present high quality GaAs epilayers that grow on virtual substrate with 100 nm Ge buffer layers. The thin Ge buffer layers were modulated by hydrogen flow rate from 60 to 90 sccm to improve crystal quality by electron cyclotron resonance chemical vapor deposition (ECR-CVD) at low growth temperature (180°C). The GaAs and Ge epilayers quality was verified by X-ray diffraction (XRD) and spectroscopy ellipsometry (SE). The full width at half maximum (FWHM) of the Ge and GaAs epilayers in XRD is 406 arcsec and 220 arcsec, respectively. In addition, the GaAs/Ge/Si interface is observed by transmission electron microscopy (TEM) to demonstrate the epitaxial growth. The defects at GaAs/Ge interface are localized within a few nanometers. It is clearly showed that the dislocation is well suppressed. The quality of the Ge buffer layer is the key of III–V/Si tandem cell. Therefore, the high quality GaAs epilayers that grow on virtual substrate with 100 nm Ge buffer layers is suitable to develop the low cost and high efficiency III–V/Si tandem solar cells.
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