2012
DOI: 10.1016/j.jnoncrysol.2012.03.025
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Future directions for higher-efficiency HIT solar cells using a Thin Silicon Wafer

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Cited by 65 publications
(20 citation statements)
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“…These can be fabricated below 200°C and hence one can use a very thin silicon wafer. The Sanyo Electric Co. (Japan) recently has achieved 22.8% efficiency using only 58 μm thick wafer and 23.7% for 98 μm thick wafers [1]. However, the interface (a-Si:H/c-Si) properties in such devices play a very crucial role for the device performance.…”
Section: Introductionmentioning
confidence: 99%
“…These can be fabricated below 200°C and hence one can use a very thin silicon wafer. The Sanyo Electric Co. (Japan) recently has achieved 22.8% efficiency using only 58 μm thick wafer and 23.7% for 98 μm thick wafers [1]. However, the interface (a-Si:H/c-Si) properties in such devices play a very crucial role for the device performance.…”
Section: Introductionmentioning
confidence: 99%
“…The HIT solar cell also exhibits decreased recombination at the interface and improved Voc due to the insertion of a very thin amorphous layer. The cell can also generate electricity from light reflected by its rear side 47…”
Section: Introductionmentioning
confidence: 99%
“…Silicon heterojunction solar cells (SHJ) are extremely appealing technology promising high conversion efficiency and low fabrication cost [1][2][3] in comparing to the traditional wafer based silicon solar cells. The SHJ structure consist of heterojunction between amorphous silicon and crystalline silicon and the output performances are strongly associated with the well-developed fabrication process of the heterointerface.…”
Section: Introductionmentioning
confidence: 99%