Fusion-bonded fluidic interconnects

Fazal, Imran; Elwenspoek, Michael Curt

doi:10.1088/0960-1317/18/5/055011

Cited by 5 publications

(6 citation statements)

References 14 publications

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“…In the work reported here, we have characterized the use of borosilicate glass tubes as fluidic interconnects. A preliminary study to this work was undertaken by Fazal et al and is reported elsewhere [7,8]. Our results demonstrate that the 3 mm inner diameter capillary connections can be safely operated at pressures of more than 7 MPa and that they are inherently hermetically sealed.…”

Section: Introductionsupporting

confidence: 50%

Characterization of MEMS-on-tube assembly: reflow bonding of borosilicate glass (Duran®) tubes to silicon substrates

Mogulkoc

Jansen

Berenschot

et al. 2009

J. Micromech. Microeng.

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Reflow bonding of borosilicate glass tubes to silicon wafers is a technology which has significant potential for microfluidic applications. The borosilicate glass tubes are designed to be used as an interface and package for wafer-level microfluidic devices. The strength of the resulting package has been tested by pressurizing it to failure. Failure occurred in the glass and the silicon adjacent to the bond, rather than along the bond itself. The bond formed is hermetic. The only leakage when testing the hermeticity of these bonds over a period of 1 month was due to gas diffusion through the glass. An unintended aspect of the heat treatments used for the reflow bonding was surface crystallization of the glass arising from heterogeneous nucleation and growth of cristobalite crystals. The bulk of the borosilicate glass remained unaffected by crystallization. For sufficiently large cristobalite crystals, microcracking occurred on the tube surface. Pressure test results indicated that the microcracking is not detrimental to the viability of this joining technology for microfluidic interconnections.

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Section: Introductionsupporting

confidence: 50%

Characterization of MEMS-on-tube assembly: reflow bonding of borosilicate glass (Duran®) tubes to silicon substrates

Mogulkoc

Jansen

Berenschot

et al. 2009

J. Micromech. Microeng.

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“…Fazal et al performed a Pyrex-tube-to-silicon bond similar to that which we present at temperatures around 680 °C. To achieve proper bonding at this temperature, the rough surface of the diced tube was polished prior to bonding [11]. The objective of our approach was to avoid additional process steps such as polishing, which meant that a higher temperature (730 °C) was required for proper bonding.…”

Section: Discussion Of the Preliminary Testmentioning

confidence: 99%

“…This bond is described in several scientific reviews, including [8,10]. The new idea of a reflow bond process with Pyrex is described by Fazal et al in [11]. By heating up Pyrex above the glass transition temperature, it becomes viscoelastic and is able to flow.…”

Section: Components Of Borosilicate Glassmentioning

confidence: 99%

“…In order to minimize residual stress in anodically bonded structures, an annealing step at temperatures above 500 °C is recommended [14]. The principles of the Pyrex-tube-to-silicon bond are presented by the group of Fazal et al [11]. Before the whole system was bonded, preliminary tests of the shear strength of the fusion bonding technique and an optimization of the trimorph Si-Pyrex-Si bond are performed which we now present.…”

Section: Fabrication and Experimentsmentioning

confidence: 99%

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Stress-Free Bonding Technology with Pyrex for Highly Integrated 3D Fluidic Microsystems

et al. 2014

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Abstract:In this article, a novel Pyrex reflow bonding technology is introduced which bonds two functional units made of silicon via a Pyrex reflow bonding process. The practical application demonstrated here is a precision dosing system that uses a mechanically actuated membrane micropump which includes passive membranes for fluid metering. To enable proper functioning after full integration, a technique for device assembly must be established which does not introduce additional stress into the system, but fulfills all other requirements, like pressure tolerance and chemical stability. This is achieved with a stress-free thermal bonding principle to bond Pyrex to silicon in a five-layer stack: after alignment, the silicon-Pyrex-silicon stack is heated to 730 °C. Above the glass transition temperature of 525 °C Pyrex exhibits viscoelastic behavior. This allows the glass layer to come into close mechanical contact with the upper and lower silicon layers. The high temperature and the close contact promotes the formation of a stable and reliable Si-O-Si bond, without introducing mechanical stress into the system, and without deformation upon cooling due to thermal mismatch.

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“…For instance, a syringe pump system with silicone rubber tubing is generally used as the external unit for operating fluids inside the microfluidic chip. Although there have been various efforts towards an integration method of the external unit into the microfluidic chip [13][14][15][16][17][18][19], complicated structures and/or sophisticated fabrication methods are mandatory in most cases. In this regard, the development of a simple interconnection scheme or novel fabrication method is considered as one of the most urgent for the practical application of various microfluidic chips.…”

Section: Introductionmentioning

confidence: 99%

A novel monolithic fabrication method for a plastic microfluidic chip with liquid interconnecting ports

Lee¹,

Kwon²

2010

J. Micromech. Microeng.

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In the present study, a novel monolithic fabrication method was developed for the manufacturing of a plastic microfluidic chip with liquid interconnecting ports. As the present method can realize both interconnecting ports and through holes, which are essential components for the delivery of working fluids, in the plastic microfluidic chip, no additional processes and external ports are required. Furthermore, the connection of external silicone tubing can be simply achieved by utilizing an elastic deformation of the used tubing. As one representative example, a microinjection molding of a prototype microfluidic chip having two types of interconnecting ports was demonstrated. After obtaining upper and lower plates by the microinjection molding process utilizing mold cores with pin structures, the thermal bonding of the molded plates was carried out, resulting in the prototype plastic microfluidic chip with interconnecting ports. From microfluidic experiments using the fabricated prototype, it was found that the present method could be quite useful in various microfluidic applications.

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Fusion-bonded fluidic interconnects

Cited by 5 publications

References 14 publications

Characterization of MEMS-on-tube assembly: reflow bonding of borosilicate glass (Duran®) tubes to silicon substrates

Characterization of MEMS-on-tube assembly: reflow bonding of borosilicate glass (Duran®) tubes to silicon substrates

Stress-Free Bonding Technology with Pyrex for Highly Integrated 3D Fluidic Microsystems

A novel monolithic fabrication method for a plastic microfluidic chip with liquid interconnecting ports

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