IAS '97. Conference Record of the 1997 IEEE Industry Applications Conference Thirty-Second IAS Annual Meeting
DOI: 10.1109/ias.1997.626335
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Fundamental study of an electrostatic chuck for silicon wafer handling

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Cited by 20 publications
(25 citation statements)
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“…Electroadhesion has been used in industry for several years in applications such as grippers [6], [7], clothing manufacturing [8], electrostatic chucks [9], [10], and in the last several years as an attachment method for climbing robots [5] and modular robots [11], [12]. Also, patents are held on the technology [15], [16], [17] and its application in several areas, including medical devices [18], climbing robots [19], grippers [20], or extension ladder stability devices [21].…”
Section: Introductionmentioning
confidence: 99%
“…Electroadhesion has been used in industry for several years in applications such as grippers [6], [7], clothing manufacturing [8], electrostatic chucks [9], [10], and in the last several years as an attachment method for climbing robots [5] and modular robots [11], [12]. Also, patents are held on the technology [15], [16], [17] and its application in several areas, including medical devices [18], climbing robots [19], grippers [20], or extension ladder stability devices [21].…”
Section: Introductionmentioning
confidence: 99%
“…Electrostatic adhesion technology was first widely used in areas of industry, such as the semiconductor industry, exposure systems, CVDs and dry etchers [6][7][8]. In electrostatic devices that are called electrostatic chucks or electrostatic grippers, it was proven that electrostatic adhesion is effective not only for conductive materials, but also for non-conductive ones, such as glass panels, fibre cloth etc.…”
Section: Introductionmentioning
confidence: 99%
“…The versatility of the electroadhesive force led to the development of wall-climbing robots [9][10][11], and perching mechanism of a robotic insect [12] in the field of robotics. For manipulation tasks, it is also applied to manipulation of arbitrary objects [13], fabrics [14], carbon fibers [15], unbound sheets of papers [16], and silicon wafers [17]. Thus far, the maximum force that electroadhesion can generate has mainly been studied [18].…”
Section: B Electroadhesive Forcementioning
confidence: 99%